---
title: "Probe head interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:PROBE_HEAD_INTERFACE"
  data_integrity_hash: "f42b00b80bb49df14615cfa9006c4639"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PROBE_HEAD_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/probe-head-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/probe-head-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-30 VDC, -20°C to +85°C, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 36
    unit: "VDC"
    consequence: "Electromigration at current density &gt; 10^6 A/cm², thermal expansion mismatch (CTE difference &gt; 15 ppm/°C) between stainless steel (17.3 ppm/°C) and FR4 substrate (14 ppm/°C), fretting corrosion at contact interfaces under vibration &gt; 5 g RMS"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with clamping voltage &lt; 15 V, 100 Ω series resistors on all signal lines, Faraday cage shielding with 40 dB attenuation at 1 GHz"
  - node_2:
      trigger: "Mechanical misalignment &gt; 0.1 mm during mating cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Guided alignment pins with H7/g6 tolerance fit, spring-loaded contacts with 2 N normal force per pin, wear-resistant gold plating (50 µin) over nickel barrier layer"
bom_nodes:
  connector-body:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_BODY"
    interface_type: "physical-logic-coupled"
  contact-pinssockets:
    type: "component"
    urn: "URN:CNFX:ME:CONTACT_PINSSOCKETS"
    interface_type: "physical-logic-coupled"
  sealing-gasketo-ring:
    type: "component"
    urn: "URN:CNFX:ME:SEALING_GASKETO_RING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 10360-2:2009 (GEOMETRICAL PRODUCT SPECIFICATIONS - ACCEPTANCE AND REVERIFICATION TESTS FOR COORDINATE MEASURING MACHINES)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/probe-head-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "f344a8448403b4749effc4d4bda9c5adc8e91da47b3db7de7a55d98c2786e78c"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Probe head interface

## 1. Technical Definition
Electrical and mechanical connection point between the multi-sensor probe head and external systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-30 VDC, -20°C to +85°C, 0-100% relative humidity (non-condensing)**. Failure boundary: **Voltage &gt; 36 VDC causes dielectric breakdown, temperature &gt; 125°C degrades polymer seals, humidity &gt; 95% RH induces galvanic corrosion at 0.5 mm/year**, Mechanism: **Electromigration at current density &gt; 10^6 A/cm², thermal expansion mismatch (CTE difference &gt; 15 ppm/°C) between stainless steel (17.3 ppm/°C) and FR4 substrate (14 ppm/°C), fretting corrosion at contact interfaces under vibration &gt; 5 g RMS**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV HBM | 8 | Gate oxide rupture in CMOS interface ICs, immediate signal distortion &gt; 50 mV p-p | TVS diodes with clamping voltage &lt; 15 V, 100 Ω series resistors on all signal lines, Faraday cage shielding with 40 dB attenuation at 1 GHz |
| Mechanical misalignment &gt; 0.1 mm during mating cycles | 8 | Contact resistance increase from 20 mΩ to &gt; 500 mΩ, intermittent data packet loss &gt; 10% | Guided alignment pins with H7/g6 tolerance fit, spring-loaded contacts with 2 N normal force per pin, wear-resistant gold plating (50 µin) over nickel barrier layer |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Multi-sensor Probe Head**, **Signal Conditioning Unit**, **Automated Test Equipment (ATE) Handler**  
**Downstream Applications**: Semiconductor Wafers, Printed Circuit Boards (PCBs), Optical Components  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in the probe head interface construction?
**A**: The probe head interface features a stainless steel housing for durability, gold-plated brass contacts for optimal electrical conductivity, and silicone rubber seals for environmental protection.

### Q: How does this interface connect multi-sensor probe heads to external systems?
**A**: This interface provides both electrical and mechanical connection points, with precision contact pins/sockets for signal transmission and a robust connector body for secure physical attachment between probe heads and external equipment.

### Q: What industries commonly use this type of probe head interface?
**A**: This probe head interface is designed for computer, electronic, and optical product manufacturing applications, particularly in precision measurement, testing, and automated inspection systems requiring reliable multi-sensor connectivity.

## 6. Manufacturing Compliance
- ISO 10360-2:2009 (GEOMETRICAL PRODUCT SPECIFICATIONS - ACCEPTANCE AND REVERIFICATION TESTS FOR COORDINATE MEASURING MACHINES)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Probe head interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/probe-head-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PROBE_HEAD_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: d6638dcb
