---
title: "Probe Interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:PROBE_INTERFACE"
  data_integrity_hash: "2e7d8e24ee22e71c33e60761a01796dd"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PROBE_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/probe-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/probe-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-10 V DC, 4-20 mA, 0-100 kHz frequency"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "m"
    consequence: "Electromigration at current densities &gt; 10^6 A/cm², dielectric breakdown at electric field strengths &gt; 3×10^6 V/m, fretting corrosion at contact pressures &lt; 0.5 N/mm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrochemical migration due to ionic contamination from flux residues"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with parylene-C (2-5 μm thickness) and automated optical inspection post-cleaning"
  - node_2:
      trigger: "Thermal cycling stress (ΔT = 85°C, 1000 cycles) causing coefficient of thermal expansion mismatch"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Underfill epoxy with CTE = 25 ppm/°C and corner bond reinforcement at stress concentration points"
bom_nodes:
  connector-housing:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_HOUSING"
    interface_type: "physical-logic-coupled"
  contact-pins:
    type: "component"
    urn: "URN:CNFX:ME:CONTACT_PINS"
    interface_type: "physical-logic-coupled"
  insulation-sleeve:
    type: "component"
    urn: "URN:CNFX:ME:INSULATION_SLEEVE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/probe-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "553dfb269c7eb60e73ff084ec5b50e6730388bcd23b4fa42d4ec9858680db634"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Probe Interface

## 1. Technical Definition
The connection point on a probe head that enables signal transmission between the probe and external measurement or control systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-10 V DC, 4-20 mA, 0-100 kHz frequency**. Failure boundary: **Contact resistance &gt; 50 mΩ, insulation breakdown at &gt; 500 V RMS, signal attenuation &gt; -3 dB at 100 kHz**, Mechanism: **Electromigration at current densities &gt; 10^6 A/cm², dielectric breakdown at electric field strengths &gt; 3×10^6 V/m, fretting corrosion at contact pressures &lt; 0.5 N/mm²**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrochemical migration due to ionic contamination from flux residues | 8 | Short circuit between adjacent pins causing signal cross-talk &gt; -20 dB isolation | Conformal coating with parylene-C (2-5 μm thickness) and automated optical inspection post-cleaning |
| Thermal cycling stress (ΔT = 85°C, 1000 cycles) causing coefficient of thermal expansion mismatch | 8 | Solder joint fatigue crack propagation leading to intermittent contact resistance &gt; 100 mΩ | Underfill epoxy with CTE = 25 ppm/°C and corner bond reinforcement at stress concentration points |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Signal Analyzer**, **Probe Station**, **Test Fixture**  
**Downstream Applications**: Semiconductor Wafers, Integrated Circuits, Electronic Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in the probe interface construction?
**A**: The probe interface is constructed with stainless steel housing for durability, gold-plated contacts for optimal signal transmission, and high-temperature plastics for thermal stability in demanding environments.

### Q: How does the probe interface ensure reliable signal transmission?
**A**: The interface uses gold-plated contact pins within an insulated housing to maintain signal integrity while preventing interference, ensuring accurate data transfer between probes and external systems.

### Q: What applications is this probe interface designed for?
**A**: This probe interface is designed for computer, electronic, and optical product manufacturing applications requiring precise measurement, testing, and control system connectivity in industrial environments.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Probe Interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/probe-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PROBE_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 09e13ef3
