---
title: "Receiver/Detector Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:RECEIVERDETECTOR_MODULE"
  data_integrity_hash: "f41bfce0a515e1674b04b68b6a15fbd2"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:RECEIVERDETECTOR_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/receiverdetector-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/receiverdetector-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-5.0 V input signal, -40°C to +85°C ambient temperature, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 5.5
    unit: "V"
    consequence: "Avalanche breakdown in PN junctions at overvoltage conditions, carrier mobility degradation and dopant diffusion at elevated temperatures, shot noise and thermal noise exceeding signal amplitude at low SNR"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated silicon-controlled rectifier (SCR) clamps with 5 ns response time and 100 pF input capacitance filtering"
  - node_2:
      trigger: "Photodiode dark current doubling every 10°C rise (Arrhenius equation with Ea=0.65 eV)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Thermoelectric cooler maintaining detector at 25°C ±0.1°C with PID control and 5 W heat dissipation capacity"
bom_nodes:
  photodetector-array:
    type: "part"
    urn: "URN:CNFX:ME:PHOTODETECTOR_ARRAY"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
  protective-window:
    type: "component"
    urn: "URN:CNFX:ME:PROTECTIVE_WINDOW"
    interface_type: "physical-logic-coupled"
  module-housing:
    type: "component"
    urn: "URN:CNFX:ME:MODULE_HOUSING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/receiverdetector-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "2dd97ac32ee6d42f8eb847b8afbe25d61401273313d94e021c928960fe74fc01"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Receiver/Detector Module

## 1. Technical Definition
A critical electronic component within an alignment sensor system that receives and detects signals for position measurement.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-5.0 V input signal, -40°C to +85°C ambient temperature, 0-100% relative humidity (non-condensing)**. Failure boundary: **Input voltage exceeding 5.5 V causes semiconductor junction breakdown, temperature beyond 125°C initiates thermal runaway, signal-to-noise ratio below 6 dB renders detection unreliable**, Mechanism: **Avalanche breakdown in PN junctions at overvoltage conditions, carrier mobility degradation and dopant diffusion at elevated temperatures, shot noise and thermal noise exceeding signal amplitude at low SNR**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV human body model | 8 | Gate oxide rupture in input protection MOSFETs | Integrated silicon-controlled rectifier (SCR) clamps with 5 ns response time and 100 pF input capacitance filtering |
| Photodiode dark current doubling every 10°C rise (Arrhenius equation with Ea=0.65 eV) | 8 | Saturation of transimpedance amplifier at &gt;1 μA dark current | Thermoelectric cooler maintaining detector at 25°C ±0.1°C with PID control and 5 W heat dissipation capacity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Photodetector Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/photodetector-array.md) `(Standalone System)`
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Signal Generator**, **Oscilloscope**, **Environmental Test Chamber**  
**Downstream Applications**: Laser Alignment Systems, Precision Measurement Instruments, Automated Optical Inspection Equipment  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this receiver/detector module?
**A**: This module receives and detects optical or electronic signals within alignment sensor systems to enable precise position measurement in industrial applications.

### Q: What materials are used in the construction of this module?
**A**: The module utilizes silicon for photodiodes/sensors, a printed circuit board (PCB) for electronics, and aluminum alloy for the durable protective housing.

### Q: How does the signal conditioning circuit improve performance?
**A**: The signal conditioning circuit amplifies, filters, and processes raw signals from the photodetector array to ensure accurate, reliable position data with minimal noise interference.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Receiver/Detector Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/receiverdetector-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: RECEIVERDETECTOR_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: ab151f36
