---
title: "Resistor Network"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:RESISTOR_NETWORK"
  data_integrity_hash: "ca9b6d41bd5f9c63f2c368c47b417ee4"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:RESISTOR_NETWORK"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/resistor-network.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/resistor-network"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "10-200°C ambient temperature, 0.1-1000 VDC working voltage, 0.01-1000 Ω resistance per element"
    unit: "Ω"
engineering_limits:
  max_safe_operating_point:
    value: 250
    unit: "°C"
    consequence: "Thermal runaway due to positive temperature coefficient exceeding material limits, dielectric breakdown at 3×10^6 V/m electric field strength, electromigration at 10^6 A/cm² current density"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 2000 V"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 5 ns response time"
  - node_2:
      trigger: "Thermal cycling between -55°C and 125°C at 100 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-tin intermetallic compound formation control with 0.5 μm maximum thickness"
bom_nodes:
  resistor-elements:
    type: "component"
    urn: "URN:CNFX:ME:RESISTOR_ELEMENTS"
    interface_type: "physical-logic-coupled"
  substrate:
    type: "component"
    urn: "URN:CNFX:ME:SUBSTRATE"
    interface_type: "physical-logic-coupled"
  terminals:
    type: "component"
    urn: "URN:CNFX:ME:TERMINALS"
    interface_type: "physical-logic-coupled"
  protective-coating:
    type: "component"
    urn: "URN:CNFX:ME:PROTECTIVE_COATING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "IEC 60115-1:2020 (FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/resistor-network.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "229d170aa9711cd6a2f3b8121c45c853117017d3a981fd2a4483f7f1d8eee470"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Resistor Network

## 1. Technical Definition
A collection of multiple resistors integrated into a single package, used to provide precise resistance values in electronic circuits.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **10-200°C ambient temperature, 0.1-1000 VDC working voltage, 0.01-1000 Ω resistance per element**. Failure boundary: **250°C junction temperature, 1500 VDC breakdown voltage, 2 W maximum power dissipation per package**, Mechanism: **Thermal runaway due to positive temperature coefficient exceeding material limits, dielectric breakdown at 3×10^6 V/m electric field strength, electromigration at 10^6 A/cm² current density**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 2000 V | 8 | Dielectric breakdown causing short circuit between resistor elements | Integrated ESD protection diodes with 5 ns response time |
| Thermal cycling between -55°C and 125°C at 100 cycles/hour | 8 | Solder joint fatigue leading to open circuit | Copper-tin intermetallic compound formation control with 0.5 μm maximum thickness |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | Ω | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Motherboards, Graphics Cards, Industrial Control Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the advantages of using resistor networks over individual resistors?
**A**: Resistor networks save space on PCBs, improve circuit reliability through matched resistance values, reduce assembly time, and enhance thermal performance in compact electronic devices.

### Q: How do thick film resistor networks perform in high-frequency applications?
**A**: Thick film resistor networks on ceramic substrates offer excellent high-frequency performance with low parasitic capacitance and inductance, making them suitable for computer and optical signal processing circuits.

### Q: What protective coatings are used for resistor networks in industrial environments?
**A**: Resistor networks typically use epoxy or silicone-based protective coatings that provide moisture resistance, mechanical protection, and thermal stability for reliable operation in demanding manufacturing environments.

## 6. Manufacturing Compliance
- IEC 60115-1:2020 (FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Resistor Network](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/resistor-network)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: RESISTOR_NETWORK | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: e642f9f9
