---
title: "Resonator Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:RESONATOR_ARRAY"
  data_integrity_hash: "371086eaf07ffa9b4220d1b0f9d4cf5a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:RESONATOR_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/resonator-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/resonator-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1.8-6.0 GHz"
    unit: "MHz"
engineering_limits:
  max_safe_operating_point:
    value: 200
    unit: "at"
    consequence: "Piezoelectric material depolarization due to exceeding Curie temperature (150°C for PZT-5A), mechanical stress-induced microcracking from thermal expansion mismatch (CTE difference &gt; 8 ppm/°C between silicon and aluminum nitride substrates), or electrode delamination at shear stress &gt; 25 MPa"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 500 V during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated spark gap protection with 200 μm spacing and conductive epoxy grounding to chassis"
  - node_2:
      trigger: "Thermal cycling between -40°C and +125°C at 10°C/min ramp rate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Palladium-coated copper wire bonding with nickel barrier layer and underfill epoxy with CTE of 12 ppm/°C"
bom_nodes:
  individual-resonator-element:
    type: "component"
    urn: "URN:CNFX:ME:INDIVIDUAL_RESONATOR_ELEMENT"
    interface_type: "physical-logic-coupled"
  interdigital-transducer-idt:
    type: "part"
    urn: "URN:CNFX:ME:INTERDIGITAL_TRANSDUCER_IDT"
    interface_type: "physical-logic-coupled"
  reflector-array:
    type: "part"
    urn: "URN:CNFX:ME:REFLECTOR_ARRAY"
    interface_type: "physical-logic-coupled"
  matching-network:
    type: "part"
    urn: "URN:CNFX:ME:MATCHING_NETWORK"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/resonator-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "6dd84b038faca530c3ae9760ad8581b5f6dbb1fa69373f0e05ce756a6b39fa62"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Resonator Array

## 1. Technical Definition
A collection of multiple resonators arranged in a specific pattern to achieve desired frequency response characteristics in RF filtering applications.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1.8-6.0 GHz**. Failure boundary: **Q-factor degradation below 200 at 25°C, insertion loss exceeding 3.0 dB, or frequency drift beyond ±0.1% of center frequency**, Mechanism: **Piezoelectric material depolarization due to exceeding Curie temperature (150°C for PZT-5A), mechanical stress-induced microcracking from thermal expansion mismatch (CTE difference &gt; 8 ppm/°C between silicon and aluminum nitride substrates), or electrode delamination at shear stress &gt; 25 MPa**.

### 2.1 Analytical Physics Model
Governed by the **Harmonic Vibration Force Generation**:

> **Primary Equation**: $F_e = m \cdot r \cdot \omega^2 \sin(\omega t)$  
> **Engineering Impact**: Calculates centrifugal force for vibratory sifters/feeders.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| m | Eccentric Mass | Engineering Constant |
| r | Radius | Engineering Constant |
| \omega | Angular Frequency | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 500 V during handling | 8 | Dielectric breakdown in piezoelectric layer creating short-circuit paths | Integrated spark gap protection with 200 μm spacing and conductive epoxy grounding to chassis |
| Thermal cycling between -40°C and +125°C at 10°C/min ramp rate | 8 | Intermetallic compound formation at gold-aluminum wire bonds increasing resistance to &gt;2 Ω | Palladium-coated copper wire bonding with nickel barrier layer and underfill epoxy with CTE of 12 ppm/°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | MHz | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Interdigital Transducer (IDT)](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interdigital-transducer-idt.md) `(Standalone System)`
- [Reflector Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/reflector-array.md) `(Standalone System)`
- [Matching Network](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **RF Signal Generator**, **Vector Network Analyzer**, **Precision Temperature Chamber**  
**Downstream Applications**: 5G Base Station Filters, Satellite Communication Modules, Radar System Components  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications of resonator arrays in computer and optical product manufacturing?
**A**: Resonator arrays are essential in RF filtering for wireless communication devices, optical signal processing, frequency control in electronic circuits, and precision timing applications in computing systems.

### Q: How does the material selection affect resonator array performance?
**A**: Piezoelectric substrates like quartz provide temperature stability, lithium niobate offers high coupling coefficients, while electrode materials (aluminum/gold/copper) affect conductivity and durability. Material choices directly impact frequency accuracy, Q-factor, and power handling.

### Q: What design considerations optimize resonator array frequency response?
**A**: Key factors include resonator element spacing, IDT finger geometry, reflector array placement, matching network design, and substrate thickness. These parameters control bandwidth, insertion loss, rejection characteristics, and temperature stability.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Resonator Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/resonator-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: RESONATOR_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 65ecc25c
