---
title: "Sensor Housing"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:SENSOR_HOUSING"
  data_integrity_hash: "13a2d0c1126c6538b8be6ed91dbfc067"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:SENSOR_HOUSING"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-housing.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-housing"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-150°C, 0-100% relative humidity, IP67 ingress protection rating"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 180
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch (polycarbonate: 70×10⁻⁶/°C, aluminum: 23×10⁻⁶/°C) causing stress concentration at mounting interfaces, hydrolytic degradation of polymer seals at elevated humidity, UV-induced chain scission in polymers at 315-400 nm wavelength exposure"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Condensation accumulation due to 95% RH cycling with 20°C temperature differential"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrate desiccant cartridge with 3Å molecular sieve, implement conformal coating per IPC-CC-830B Class 3, design condensation drainage channels with 3° minimum slope"
  - node_2:
      trigger: "Vibration-induced fatigue at 200 Hz resonant frequency matching motor harmonic"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply thread-locking compound per MIL-SPEC 46146, implement anti-vibration mounting with 40 Shore A durometer isolators, redesign mounting geometry to shift natural frequency to 350 Hz"
bom_nodes:
  main-body:
    type: "component"
    urn: "URN:CNFX:ME:MAIN_BODY"
    interface_type: "physical-logic-coupled"
  coverlid:
    type: "component"
    urn: "URN:CNFX:ME:COVERLID"
    interface_type: "physical-logic-coupled"
  gasketseal:
    type: "component"
    urn: "URN:CNFX:ME:GASKETSEAL"
    interface_type: "physical-logic-coupled"
  mounting-flange:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_FLANGE"
    interface_type: "physical-logic-coupled"
  cable-gland:
    type: "part"
    urn: "URN:CNFX:ME:CABLE_GLAND"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU FOR ELECTRICAL EQUIPMENT)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-housing.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "40e37c2597b46bfcabd307b3f2cbc8c91d2471a43205bfa0475fbea4fef87a74"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Sensor Housing

## 1. Technical Definition
Protective enclosure for sensor components within a sensor array system

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-150°C, 0-100% relative humidity, IP67 ingress protection rating**. Failure boundary: **Structural deformation at 180°C (glass transition temperature of polycarbonate), seal failure at 125°C (silicone gasket thermal limit), crack propagation at -40°C (brittle fracture threshold)**, Mechanism: **Thermal expansion coefficient mismatch (polycarbonate: 70×10⁻⁶/°C, aluminum: 23×10⁻⁶/°C) causing stress concentration at mounting interfaces, hydrolytic degradation of polymer seals at elevated humidity, UV-induced chain scission in polymers at 315-400 nm wavelength exposure**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Condensation accumulation due to 95% RH cycling with 20°C temperature differential | 8 | Electrochemical migration forming dendritic growth between PCB traces at 5V potential | Integrate desiccant cartridge with 3Å molecular sieve, implement conformal coating per IPC-CC-830B Class 3, design condensation drainage channels with 3° minimum slope |
| Vibration-induced fatigue at 200 Hz resonant frequency matching motor harmonic | 8 | Threaded fastener loosening below 70% of initial preload, leading to housing displacement exceeding 0.5 mm | Apply thread-locking compound per MIL-SPEC 46146, implement anti-vibration mounting with 40 Shore A durometer isolators, redesign mounting geometry to shift natural frequency to 350 Hz |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Cable Gland](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/cable-gland.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Injection Molding Machine**, **Industrial Chiller**, **Hopper Dryer**  
**Downstream Applications**: Automotive Sensor Arrays, Industrial Automation Sensors, Consumer Electronics Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are available for the sensor housing?
**A**: Our sensor housings are manufactured in aluminum alloy for lightweight durability, stainless steel for corrosion resistance, and engineering plastics for cost-effective solutions in computer and optical product applications.

### Q: What components are included in the standard BOM?
**A**: The standard bill of materials includes: Main Body, Cover/Lid, Gasket/Seal for environmental protection, Mounting Flange for secure installation, and Cable Gland for wiring management in sensor array systems.

### Q: How does this housing protect sensor components?
**A**: The housing provides complete environmental protection for sensitive sensor arrays with sealed enclosures that shield against dust, moisture, and physical damage, ensuring reliable performance in manufacturing environments.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (EU DIRECTIVE 2014/35/EU FOR ELECTRICAL EQUIPMENT)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Sensor Housing](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-housing)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: SENSOR_HOUSING | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: ef96f10a
