---
title: "Sensor Interface Board"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:SENSOR_INTERFACE_BOARD"
  data_integrity_hash: "f543e67ec89ac4156cfe063ba63841fe"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:SENSOR_INTERFACE_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-interface-board.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-interface-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-5 VDC input, -40 to 85°C ambient temperature, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 6.5
    unit: "VDC"
    consequence: "Semiconductor junction breakdown at 6.5 VDC exceeds silicon dioxide dielectric strength of 10 MV/m, FR4 glass transition temperature at 125°C reduces mechanical stability, electrochemical migration at &gt;0.7 V potential difference with moisture"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5 ns response time and 500 W peak pulse power rating"
  - node_2:
      trigger: "Thermal cycling between -40°C and 85°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Underfill epoxy with 25 ppm/°C CTE and corner bond reinforcement"
bom_nodes:
  signal-conditioning-circuitry:
    type: "part"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUITRY"
    interface_type: "physical-logic-coupled"
  microcontrollerprocessor:
    type: "part"
    urn: "URN:CNFX:ME:MICROCONTROLLERPROCESSOR"
    interface_type: "physical-logic-coupled"
  power-regulation-circuit:
    type: "part"
    urn: "URN:CNFX:ME:POWER_REGULATION_CIRCUIT"
    interface_type: "physical-logic-coupled"
  communication-interface:
    type: "part"
    urn: "URN:CNFX:ME:COMMUNICATION_INTERFACE"
    interface_type: "physical-logic-coupled"
  sensor-connectors:
    type: "component"
    urn: "URN:CNFX:ME:SENSOR_CONNECTORS"
    interface_type: "physical-logic-coupled"
  protection-circuits:
    type: "part"
    urn: "URN:CNFX:ME:PROTECTION_CIRCUITS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-interface-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "beaf9e7d8cff6ee176ee11882deaa47f7c3418ef39955c3d1a33c008154fc20e"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Sensor Interface Board

## 1. Technical Definition
A printed circuit board that provides electrical interface and signal conditioning between sensors and control systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-5 VDC input, -40 to 85°C ambient temperature, 0-100% relative humidity (non-condensing)**. Failure boundary: **Input voltage exceeding 6.5 VDC causes op-amp saturation, temperature exceeding 125°C initiates FR4 substrate glass transition, humidity exceeding 85% RH at 40°C triggers dendritic growth**, Mechanism: **Semiconductor junction breakdown at 6.5 VDC exceeds silicon dioxide dielectric strength of 10 MV/m, FR4 glass transition temperature at 125°C reduces mechanical stability, electrochemical migration at &gt;0.7 V potential difference with moisture**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV human body model | 8 | CMOS input protection diode avalanche breakdown causing latch-up | TVS diodes with 5 ns response time and 500 W peak pulse power rating |
| Thermal cycling between -40°C and 85°C at 10 cycles/hour | 8 | Solder joint fatigue failure due to CTE mismatch (FR4: 14 ppm/°C, SAC305: 22 ppm/°C) | Underfill epoxy with 25 ppm/°C CTE and corner bond reinforcement |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Signal Conditioning Circuitry](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuitry.md) `(Standalone System)`
- [Microcontroller/Processor](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/microcontrollerprocessor.md) `(Standalone System)`
- [Power Regulation Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-regulation-circuit.md) `(Standalone System)`
- [Communication Interface](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface.md) `(Standalone System)`
- [Protection Circuits](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/protection-circuits.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Industrial Automation Controllers, Medical Monitoring Devices, Automotive Sensor Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this sensor interface board?
**A**: This board provides electrical interface and signal conditioning between various sensors and control systems, ensuring accurate data transmission and processing in industrial automation applications.

### Q: What materials are used in the construction of this interface board?
**A**: The board is constructed using FR-4 PCB substrate with copper traces, and includes electronic components such as ICs, resistors, capacitors, and connectors for reliable performance in industrial environments.

### Q: What key components are included in the board's bill of materials?
**A**: The BOM includes communication interface, microcontroller/processor, power regulation circuit, protection circuits, sensor connectors, and signal conditioning circuitry for comprehensive sensor integration.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Sensor Interface Board](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/sensor-interface-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **6** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: SENSOR_INTERFACE_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 10c0eb9d
