---
title: "Substrate Holder"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:SUBSTRATE_HOLDER"
  data_integrity_hash: "3b0cd2865051f610a58eda047c34d038"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:SUBSTRATE_HOLDER"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/substrate-holder.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/substrate-holder"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "10â»â¶ to 10â»Â² mbar vacuum pressure, 20-150Â°C temperature, 0.1-5.0 NÂ·m clamping torque"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "Â"
    consequence: "Outgassing-induced pressure rise exceeding Knudsen flow regime (Î»/d &lt; 0.01), differential thermal expansion (Î”Î± = 23Ã—10â»â¶ Kâ»Â¹ between Invar and fused silica), stress concentration at clamping interfaces exceeding yield strength (Ïƒ &gt; 250 MPa)"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Residual hydrocarbon contamination (Câ‚“Háµ§) on substrate surface"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Plasma cleaning with 13.56 MHz RF discharge at 100 W for 300 s in 0.5 mbar Ar/Oâ‚‚ mixture"
  - node_2:
      trigger: "Thermal gradient of &gt;50Â°C/mm across holder during bake-out"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gradient-limited heating ramp of 2Â°C/min with PID control (Kâ‚š=1.2, Káµ¢=0.05, K_d=0.1)"
bom_nodes:
  clamping-mechanism:
    type: "part"
    urn: "URN:CNFX:ME:CLAMPING_MECHANISM"
    interface_type: "physical-logic-coupled"
  rotation-interface:
    type: "part"
    urn: "URN:CNFX:ME:ROTATION_INTERFACE"
    interface_type: "physical-logic-coupled"
  thermal-plate:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_PLATE"
    interface_type: "physical-logic-coupled"
  mounting-base:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BASE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - EU MACHINERY DIRECTIVE 2006/42/EC"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/substrate-holder.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "e451032f477d006c2a8e01e7d41e3f0c0d7b2763d5145b2110802326dc52f2f6"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Substrate Holder

## 1. Technical Definition
A precision fixture that securely holds optical lens substrates during the coating process in a vacuum chamber.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **10â»â¶ to 10â»Â² mbar vacuum pressure, 20-150Â°C temperature, 0.1-5.0 NÂ·m clamping torque**. Failure boundary: **Vacuum leak at &gt;10â»Â³ mbar, thermal expansion mismatch &gt;15 Âµm at 200Â°C, clamping force &lt;0.05 NÂ·m or &gt;7.0 NÂ·m**, Mechanism: **Outgassing-induced pressure rise exceeding Knudsen flow regime (Î»/d &lt; 0.01), differential thermal expansion (Î”Î± = 23Ã—10â»â¶ Kâ»Â¹ between Invar and fused silica), stress concentration at clamping interfaces exceeding yield strength (Ïƒ &gt; 250 MPa)**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Residual hydrocarbon contamination (Câ‚“Háµ§) on substrate surface | 8 | Film adhesion failure (delamination &gt;ISO Class 3) | Plasma cleaning with 13.56 MHz RF discharge at 100 W for 300 s in 0.5 mbar Ar/Oâ‚‚ mixture |
| Thermal gradient of &gt;50Â°C/mm across holder during bake-out | 8 | Substrate fracture along crystallographic planes (111) in Si | Gradient-limited heating ramp of 2Â°C/min with PID control (Kâ‚š=1.2, Káµ¢=0.05, K_d=0.1) |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Clamping Mechanism](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/clamping-mechanism.md) `(Standalone System)`
- [Rotation Interface](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/rotation-interface.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vacuum Coating System**, **Precision Cleaning Station**, **Optical Coating Thickness Monitor**  
**Downstream Applications**: Camera Lenses, Microscope Objectives, Laser Optics  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this substrate holder and why?
**A**: This substrate holder uses stainless steel for durability and corrosion resistance, aluminum alloy for lightweight structural components, and ceramic for the thermal plate to withstand high temperatures and provide excellent thermal stability during the coating process.

### Q: How does the clamping mechanism secure optical lens substrates?
**A**: The precision clamping mechanism applies uniform pressure without damaging delicate substrates, ensuring secure positioning during the entire vacuum coating process while maintaining optical alignment and preventing movement or vibration.

### Q: What are the key applications for this substrate holder in optical manufacturing?
**A**: This substrate holder is specifically designed for optical lens coating applications including anti-reflective coatings, mirror coatings, filter coatings, and other thin-film deposition processes in vacuum chambers used in computer, electronic, and optical product manufacturing.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - EU MACHINERY DIRECTIVE 2006/42/EC

---
### ðŸ› ï¸ Engineering Resource Access
ðŸ”— **[Full Specification: Substrate Holder](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/substrate-holder)**

### ðŸŒ Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: SUBSTRATE_HOLDER | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: b250a2ec
