---
title: "Test Fixture Interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:TEST_FIXTURE_INTERFACE"
  data_integrity_hash: "ce281312150d89d39df12e5f818ce5e9"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:TEST_FIXTURE_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/test-fixture-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/test-fixture-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-5 VDC signal range, 0-100 mA current capacity, -40°C to +85°C temperature range"
    unit: "count"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "m"
    consequence: "Electromigration at current densities &gt;1×10⁶ A/cm² causing open circuits, differential thermal expansion (CTE mismatch of 16 ppm/°C between connector materials) causing contact separation, dielectric breakdown at &gt;300 V/mil in insulation materials"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated TVS diodes with 5 ns response time, controlled impedance PCB routing with 50 Ω termination"
  - node_2:
      trigger: "Cyclic mechanical stress from 10,000+ mating cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gold-plated contacts (50 µin minimum thickness), spring-loaded pogo pins with 100,000 cycle rating, anti-wear lubricant with 0.15 friction coefficient"
bom_nodes:
  contact-array:
    type: "part"
    urn: "URN:CNFX:ME:CONTACT_ARRAY"
    interface_type: "physical-logic-coupled"
  interface-pcb:
    type: "part"
    urn: "URN:CNFX:ME:INTERFACE_PCB"
    interface_type: "physical-logic-coupled"
  alignment-guide:
    type: "part"
    urn: "URN:CNFX:ME:ALIGNMENT_GUIDE"
    interface_type: "physical-logic-coupled"
  housingframe:
    type: "component"
    urn: "URN:CNFX:ME:HOUSINGFRAME"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI B4.1-1967 - PREFERRED LIMITS AND FITS FOR CYLINDRICAL PARTS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/test-fixture-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "09ca4fbb91408cceda7f9da1dcf4a26cc9ec10b33a69b6a42e286491a39c6cc9"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Test Fixture Interface

## 1. Technical Definition
Interface component connecting the motherboard under test to the burn-in tester's control and measurement systems

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-5 VDC signal range, 0-100 mA current capacity, -40°C to +85°C temperature range**. Failure boundary: **Signal integrity loss at &gt;2.5% voltage deviation from reference, contact resistance &gt;50 mΩ, thermal runaway at &gt;90°C junction temperature**, Mechanism: **Electromigration at current densities &gt;1×10⁶ A/cm² causing open circuits, differential thermal expansion (CTE mismatch of 16 ppm/°C between connector materials) causing contact separation, dielectric breakdown at &gt;300 V/mil in insulation materials**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV HBM | 8 | Gate oxide breakdown in interface ICs, immediate signal path failure | Integrated TVS diodes with 5 ns response time, controlled impedance PCB routing with 50 Ω termination |
| Cyclic mechanical stress from 10,000+ mating cycles | 8 | Contact wear exceeding 0.1 mm depth, increased contact resistance causing signal attenuation | Gold-plated contacts (50 µin minimum thickness), spring-loaded pogo pins with 100,000 cycle rating, anti-wear lubricant with 0.15 friction coefficient |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | count | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Contact Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/contact-array.md) `(Standalone System)`
- [Interface PCB](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interface-pcb.md) `(Standalone System)`
- [Alignment Guide](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/alignment-guide.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Burn-in Test Chamber**, **Automated Test Equipment (ATE) Handler**, **Thermal Management System**  
**Downstream Applications**: Server Motherboards, Telecommunications Equipment, Medical Diagnostic Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this test fixture interface and why?
**A**: Phosphor bronze contacts ensure excellent conductivity and spring properties, FR-4 PCB substrate provides electrical insulation and mechanical stability, and stainless steel housing offers durability and EMI shielding for reliable testing environments.

### Q: How does this interface component connect to burn-in test systems?
**A**: The interface connects the motherboard under test to the tester's control and measurement systems through the contact array and interface PCB, enabling signal transmission, power delivery, and data acquisition during burn-in testing procedures.

### Q: What are the key components in the BOM for this test fixture interface?
**A**: The bill of materials includes: Alignment Guide for precise motherboard positioning, Contact Array with phosphor bronze pins, Housing/Frame for structural integrity, and Interface PCB for electrical routing and connection management.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- ANSI B4.1-1967 - PREFERRED LIMITS AND FITS FOR CYLINDRICAL PARTS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Test Fixture Interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/test-fixture-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: TEST_FIXTURE_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 96367cad
