---
title: "Test Probe Assembly"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:TEST_PROBE_ASSEMBLY"
  data_integrity_hash: "3b023825b9c4c4f25afb8bc84dd535e3"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:TEST_PROBE_ASSEMBLY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/test-probe-assembly.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/test-probe-assembly"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-10 N contact force, 0.5-1000 VDC, -40°C to 125°C ambient temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "m"
    consequence: "Electromigration at probe tips due to current density exceeding 10⁶ A/cm², mechanical fatigue from cyclic loading during repeated insertions, dielectric breakdown at 3×10⁶ V/m electric field strength"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated spark gap protection with 500 μm gap spacing on probe substrate"
  - node_2:
      trigger: "Probe tip oxidation at temperatures above 85°C in humid environments (&gt;60% RH)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gold plating with minimum 0.5 μm thickness over nickel underplate"
bom_nodes:
  probe-tip:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_TIP"
    interface_type: "physical-logic-coupled"
  spring-mechanism:
    type: "component"
    urn: "URN:CNFX:ME:SPRING_MECHANISM"
    interface_type: "physical-logic-coupled"
  probe-bodyhousing:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_BODYHOUSING"
    interface_type: "physical-logic-coupled"
  mounting-platepcb:
    type: "part"
    urn: "URN:CNFX:ME:MOUNTING_PLATEPCB"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU FOR ELECTRICAL EQUIPMENT)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/test-probe-assembly.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "87ca640b926ce212efc5bd42c1573bbdb0073639205d29e78d18ded3cc761d27"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Test Probe Assembly

## 1. Technical Definition
A precision assembly of electrical probes used for making temporary electrical connections to test points on electronic devices or circuits.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-10 N contact force, 0.5-1000 VDC, -40°C to 125°C ambient temperature**. Failure boundary: **Contact resistance exceeding 50 mΩ at 1 A test current, probe tip wear exceeding 0.05 mm from original geometry, insulation breakdown at 1500 VAC**, Mechanism: **Electromigration at probe tips due to current density exceeding 10⁶ A/cm², mechanical fatigue from cyclic loading during repeated insertions, dielectric breakdown at 3×10⁶ V/m electric field strength**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV human body model | 8 | Insulation breakdown between adjacent probe pins | Integrated spark gap protection with 500 μm gap spacing on probe substrate |
| Probe tip oxidation at temperatures above 85°C in humid environments (&gt;60% RH) | 8 | Contact resistance increase beyond 100 mΩ | Gold plating with minimum 0.5 μm thickness over nickel underplate |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Mounting Plate/PCB](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-platepcb.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Microscope Inspection Station**, **Precision Force Calibration System**, **ESD-Safe Workstation**  
**Downstream Applications**: Semiconductor Test Fixtures, Printed Circuit Board Test Rigs, Automated Test Equipment (ATE) Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this test probe assembly and why?
**A**: This assembly uses Beryllium Copper and Phosphor Bronze for excellent spring properties and conductivity, Tungsten Carbide for durable probe tips, and gold-plated tips to prevent oxidation and ensure reliable electrical connections during testing.

### Q: What are the main components of this test probe assembly?
**A**: The assembly consists of four key components: Probe Tip for making electrical contact, Spring Mechanism for consistent pressure, Probe Body/Housing for structural integrity, and Mounting Plate/PCB for secure installation in test fixtures.

### Q: How does this test probe assembly benefit electronic manufacturing testing?
**A**: It provides precise, temporary electrical connections to test points on electronic devices and circuits, enabling accurate testing during manufacturing. The durable materials and spring mechanism ensure consistent performance and longevity in production environments.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (EU DIRECTIVE 2014/35/EU FOR ELECTRICAL EQUIPMENT)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Test Probe Assembly](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/test-probe-assembly)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: TEST_PROBE_ASSEMBLY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 49b70924
