---
title: "Thermal Management Interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:THERMAL_MANAGEMENT_INTERFACE"
  data_integrity_hash: "03f2936fce2c5d5863dd8e67d6cdd15c"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:THERMAL_MANAGEMENT_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/thermal-management-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/thermal-management-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-2.0 MPa"
    unit: "W/m·K"
engineering_limits:
  max_safe_operating_point:
    value: 2.5
    unit: "MPa"
    consequence: "Thermal stress-induced microcrack propagation in aluminum 6061-T6 interface plate exceeding yield strength of 276 MPa at 150°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal expansion mismatch between nickel-plated copper thermal pads (CTE 17.0×10⁻⁶/K) and aluminum 6061-T6 interface plate (CTE 23.6×10⁻⁶/K)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Graded CTE interlayer using aluminum-silicon carbide metal matrix composite (CTE 19.5×10⁻⁶/K)"
  - node_2:
      trigger: "Galvanic corrosion at aluminum-copper interface with electrolyte formation from polyglycol coolant degradation"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Anodized aluminum oxide coating (25 μm thickness) with nickel interlayer for galvanic isolation"
bom_nodes:
  interface-plate:
    type: "component"
    urn: "URN:CNFX:ME:INTERFACE_PLATE"
    interface_type: "physical-logic-coupled"
  thermal-padgrease-layer:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_PADGREASE_LAYER"
    interface_type: "physical-logic-coupled"
  mounting-features:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_FEATURES"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 22007-2:2022 - THERMAL CONDUCTIVITY AND THERMAL DIFFUSIVITY MEASUREMENT"
    scope: "Verified Engineering Specification"
  - standard: "IEC 60068-2-14:2009 - ENVIRONMENTAL TESTING - PART 2-14: TESTS - TEST N: CHANGE OF TEMPERATURE"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/thermal-management-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "c03271cc3a9bcfbd627c9ab788d2eefc202996e5a3dd4e0b7cb106e198fff314"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Thermal Management Interface

## 1. Technical Definition
Interface component within a solid-state cell module that facilitates heat transfer between the battery cells and external thermal management systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-2.0 MPa**. Failure boundary: **2.5 MPa internal pressure differential**, Mechanism: **Thermal stress-induced microcrack propagation in aluminum 6061-T6 interface plate exceeding yield strength of 276 MPa at 150°C**.

### 2.1 Analytical Physics Model
Governed by the **LMTD Logarithmic Mean Temperature Difference**:

> **Primary Equation**: $Q = U \cdot A \cdot \Delta T_{lm}$  
> **Engineering Impact**: Sizing validation for pasteurization and cooling tunnels.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| U | Heat Transfer Coeff | Engineering Constant |
| A | Area | Engineering Constant |
| \Delta T_{lm} | LMTD | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal expansion mismatch between nickel-plated copper thermal pads (CTE 17.0×10⁻⁶/K) and aluminum 6061-T6 interface plate (CTE 23.6×10⁻⁶/K) | 8 | Interface delamination reducing thermal conductivity from 200 W/m·K to below 50 W/m·K | Graded CTE interlayer using aluminum-silicon carbide metal matrix composite (CTE 19.5×10⁻⁶/K) |
| Galvanic corrosion at aluminum-copper interface with electrolyte formation from polyglycol coolant degradation | 8 | Contact resistance increase from 0.5 mΩ to above 5.0 mΩ at 25°C | Anodized aluminum oxide coating (25 μm thickness) with nickel interlayer for galvanic isolation |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | W/m·K | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Thermal Interface Material Dispenser**, **Automated Assembly Robot**, **Thermal Cycling Test Chamber**  
**Downstream Applications**: Electric Vehicle Battery Packs, Portable Electronics Battery Modules, Energy Storage System Battery Racks  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this thermal management interface?
**A**: This interface component facilitates efficient heat transfer between battery cells and external thermal management systems in solid-state battery modules, preventing overheating and maintaining optimal operating temperatures.

### Q: What materials are used in this thermal interface component?
**A**: The interface is constructed from aluminum alloy and copper for structural components, combined with thermal interface materials (TIM) such as thermal pads or grease layers to maximize thermal conductivity.

### Q: How does this component integrate with battery module systems?
**A**: It features mounting features for secure installation and interfaces directly with both battery cells and external cooling systems, creating a complete thermal pathway for heat dissipation in electronic and optical product applications.

## 6. Manufacturing Compliance
- ISO 22007-2:2022 - THERMAL CONDUCTIVITY AND THERMAL DIFFUSIVITY MEASUREMENT
- IEC 60068-2-14:2009 - ENVIRONMENTAL TESTING - PART 2-14: TESTS - TEST N: CHANGE OF TEMPERATURE

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Thermal Management Interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/thermal-management-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: THERMAL_MANAGEMENT_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 734950a1
