---
title: "Transducer Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:TRANSDUCER_ARRAY"
  data_integrity_hash: "7185a84a47783539338b6f668d08bfe1"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:TRANSDUCER_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/transducer-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/transducer-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-15 MHz frequency, -20°C to +85°C ambient temperature, 0-100 kPa pressure differential"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Thermal depolarization of PZT-5A piezoelectric material above Curie temperature, acoustic energy reflection due to impedance mismatch exceeding 5%, adhesive failure at epoxy-glass interface under cyclic thermal loading"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Voltage transient exceeding 200% rated 100Vpp excitation"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diode clamping at 120V with 1ns response time"
  - node_2:
      trigger: "Thermal cycling between -40°C and +125°C at 10°C/min gradient"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Silicone-based gel with 0.5% thermal expansion coefficient matching"
bom_nodes:
  piezoelectric-element:
    type: "component"
    urn: "URN:CNFX:ME:PIEZOELECTRIC_ELEMENT"
    interface_type: "physical-logic-coupled"
  electrode:
    type: "component"
    urn: "URN:CNFX:ME:ELECTRODE"
    interface_type: "physical-logic-coupled"
  acoustic-matching-layer:
    type: "component"
    urn: "URN:CNFX:ME:ACOUSTIC_MATCHING_LAYER"
    interface_type: "physical-logic-coupled"
  backing-block:
    type: "component"
    urn: "URN:CNFX:ME:BACKING_BLOCK"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 18563-1:2015 (NON-DESTRUCTIVE TESTING - ULTRASONIC TESTING - CHARACTERIZATION AND VERIFICATION OF ULTRASONIC TRANSDUCER ARRAYS)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASME B46.1-2019 (SURFACE TEXTURE, SURFACE ROUGHNESS, WAVINESS, AND LAY)"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 12668-1:2010 (NON-DESTRUCTIVE TESTING - CHARACTERIZATION AND VERIFICATION OF ULTRASONIC EXAMINATION EQUIPMENT - PART 1: INSTRUMENTS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/transducer-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "5adc10630d971fc0f91de20b9d3105f851181daa6eafd50529da76dd516303ed"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Transducer Array

## 1. Technical Definition
A structured arrangement of multiple transducer elements designed to emit and receive ultrasonic signals in a coordinated manner.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-15 MHz frequency, -20°C to +85°C ambient temperature, 0-100 kPa pressure differential**. Failure boundary: **Piezoelectric depolarization at 150°C Curie temperature, acoustic impedance mismatch &gt;5% from 1.5 MRayl baseline, element delamination at 50 MPa shear stress**, Mechanism: **Thermal depolarization of PZT-5A piezoelectric material above Curie temperature, acoustic energy reflection due to impedance mismatch exceeding 5%, adhesive failure at epoxy-glass interface under cyclic thermal loading**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Voltage transient exceeding 200% rated 100Vpp excitation | 8 | Piezoelectric element dielectric breakdown | TVS diode clamping at 120V with 1ns response time |
| Thermal cycling between -40°C and +125°C at 10°C/min gradient | 8 | Acoustic coupling gel viscosity degradation | Silicone-based gel with 0.5% thermal expansion coefficient matching |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Ultrasonic Signal Generator**, **Multi-Channel Data Acquisition System**, **Precision Positioning System**  
**Downstream Applications**: Medical Ultrasound Imaging Systems, Non-Destructive Testing Equipment, Sonar Arrays for Marine Applications  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key advantages of using piezoelectric ceramic (PZT) in transducer arrays?
**A**: PZT ceramics offer high electromechanical coupling, excellent temperature stability, and precise ultrasonic signal generation, making them ideal for coordinated array applications in electronic manufacturing.

### Q: How does the acoustic matching layer improve transducer array performance?
**A**: The acoustic matching layer optimizes impedance between transducer elements and the medium, reducing signal loss and improving energy transfer efficiency for clearer ultrasonic reception and emission.

### Q: What applications in computer and optical manufacturing benefit from transducer arrays?
**A**: Transducer arrays are used in precision ultrasonic testing, non-destructive evaluation of electronic components, optical alignment systems, and quality control processes requiring coordinated signal emission.

## 6. Manufacturing Compliance
- ISO 18563-1:2015 (NON-DESTRUCTIVE TESTING - ULTRASONIC TESTING - CHARACTERIZATION AND VERIFICATION OF ULTRASONIC TRANSDUCER ARRAYS)
- ANSI/ASME B46.1-2019 (SURFACE TEXTURE, SURFACE ROUGHNESS, WAVINESS, AND LAY)
- DIN EN 12668-1:2010 (NON-DESTRUCTIVE TESTING - CHARACTERIZATION AND VERIFICATION OF ULTRASONIC EXAMINATION EQUIPMENT - PART 1: INSTRUMENTS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Transducer Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/transducer-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: TRANSDUCER_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: e13350cf
