---
title: "Triaxial Gyroscope"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:TRIAXIAL_GYROSCOPE"
  data_integrity_hash: "650bf1a0502d96832a78c636822ecbfe"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:TRIAXIAL_GYROSCOPE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/triaxial-gyroscope.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/triaxial-gyroscope"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "±2000°/s angular velocity, -40°C to +85°C temperature, 3.3V ±5% supply voltage"
    unit: "°/s"
engineering_limits:
  max_safe_operating_point:
    value: 3000
    unit: "°"
    consequence: "Silicon MEMS structure fracture at 1.2 GPa stress limit (exceeding yield strength), thermal expansion coefficient mismatch (Si: 2.6×10⁻⁶/K vs SiO₂: 0.5×10⁻⁶/K) causing delamination, CMOS gate oxide breakdown at 10 MV/cm electric field"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Coriolis force imbalance exceeding 0.1 mN due to MEMS mass asymmetry"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Laser trimming of MEMS proof masses to achieve &lt;0.01% mass symmetry, closed-loop capacitive feedback with 16-bit DAC correction"
  - node_2:
      trigger: "Capacitive sensing gap contamination by 100 nm particulate matter"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Hermetic wafer-level packaging with 10⁻⁶ mbar vacuum, getter material (Zr-V-Fe alloy) with 10 cm³/g adsorption capacity"
bom_nodes:
  proof-mass:
    type: "component"
    urn: "URN:CNFX:ME:PROOF_MASS"
    interface_type: "physical-logic-coupled"
  drive-electrodes:
    type: "component"
    urn: "URN:CNFX:ME:DRIVE_ELECTRODES"
    interface_type: "physical-logic-coupled"
  sense-electrodes:
    type: "component"
    urn: "URN:CNFX:ME:SENSE_ELECTRODES"
    interface_type: "physical-logic-coupled"
  asic:
    type: "part"
    urn: "URN:CNFX:ME:ASIC"
    interface_type: "physical-logic-coupled"
  package:
    type: "component"
    urn: "URN:CNFX:ME:PACKAGE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 8727:1997 - MECHANICAL VIBRATION AND SHOCK - BALANCING OF ROTATING RIGID BODIES"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ISA-37.1-1975 (R2018) - SPECIFICATIONS AND TESTS FOR PIEZOELECTRIC ACCELERATION TRANSDUCERS"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 60068-2-6:2008 - ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/triaxial-gyroscope.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "66e71d4ecb741502ee3d8a0471e1f5d6e2804499e9ae21764d23e2972bf54595"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Triaxial Gyroscope

## 1. Technical Definition
A sensor that measures angular velocity around three orthogonal axes (X, Y, Z).

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **±2000°/s angular velocity, -40°C to +85°C temperature, 3.3V ±5% supply voltage**. Failure boundary: **Angular velocity exceeding ±3000°/s causes MEMS structure fracture, temperature beyond -55°C/+125°C induces material phase changes, supply voltage exceeding 5.5V triggers CMOS circuit breakdown**, Mechanism: **Silicon MEMS structure fracture at 1.2 GPa stress limit (exceeding yield strength), thermal expansion coefficient mismatch (Si: 2.6×10⁻⁶/K vs SiO₂: 0.5×10⁻⁶/K) causing delamination, CMOS gate oxide breakdown at 10 MV/cm electric field**.

### 2.1 Analytical Physics Model
Governed by the **L10 Bearing Life & Fatigue Model**:

> **Primary Equation**: $L_{10} = (\frac{C}{P})^p$  
> **Engineering Impact**: Predicts mechanical lifecycle before component fatigue.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| C | Dynamic Load Rating | Engineering Constant |
| P | Equivalent Dynamic Load | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Coriolis force imbalance exceeding 0.1 mN due to MEMS mass asymmetry | 8 | Zero-rate output drift exceeding 0.1°/s, scale factor nonlinearity &gt;1% | Laser trimming of MEMS proof masses to achieve &lt;0.01% mass symmetry, closed-loop capacitive feedback with 16-bit DAC correction |
| Capacitive sensing gap contamination by 100 nm particulate matter | 8 | Signal-to-noise ratio degradation below 40 dB, quadrature error &gt;0.5° | Hermetic wafer-level packaging with 10⁻⁶ mbar vacuum, getter material (Zr-V-Fe alloy) with 10 cm³/g adsorption capacity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | °/s | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [ASIC](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/asic.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Calibration Equipment**, **Clean Room Assembly Station**, **Automated Test Handler**  
**Downstream Applications**: Consumer Drones, Virtual Reality Headsets, Industrial Robotics  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the main applications of a triaxial gyroscope in computer and electronic manufacturing?
**A**: Triaxial gyroscopes are essential for motion sensing in devices like smartphones, drones, robotics, and navigation systems, providing precise orientation and stabilization data across all three axes.

### Q: How does the MEMS silicon construction benefit industrial gyroscope performance?
**A**: MEMS silicon construction enables miniaturization, low power consumption, high reliability, and cost-effective mass production while maintaining precise measurement of angular velocity in compact industrial applications.

### Q: What is the difference between piezoelectric and FOG (Fiber Optic Gyroscope) technologies in triaxial gyroscopes?
**A**: Piezoelectric gyroscopes use vibrating materials to detect Coriolis forces, offering compact size and affordability, while FOG uses optical interference in fiber coils for higher precision and stability in demanding industrial environments.

## 6. Manufacturing Compliance
- ISO 8727:1997 - MECHANICAL VIBRATION AND SHOCK - BALANCING OF ROTATING RIGID BODIES
- ANSI/ISA-37.1-1975 (R2018) - SPECIFICATIONS AND TESTS FOR PIEZOELECTRIC ACCELERATION TRANSDUCERS
- DIN EN 60068-2-6:2008 - ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Triaxial Gyroscope](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/triaxial-gyroscope)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: TRIAXIAL_GYROSCOPE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: d98b4223
