---
title: "Vacuum Chamber Body"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:VACUUM_CHAMBER_BODY"
  data_integrity_hash: "5935db70eb56020fe9c3a2f9b033846e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:VACUUM_CHAMBER_BODY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/vacuum-chamber-body.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/vacuum-chamber-body"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1e-6 to 1e-3 mbar (1e-4 to 0.1 Pa)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 1.0
    unit: "mbar"
    consequence: "Buckling instability due to Euler critical load exceeding material yield strength (σ_y ≥ 250 MPa for 316L stainless steel) at pressure differential ΔP &gt; 50 kPa"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Cyclic thermal stress from 293K to 473K bakeout cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Finite element analysis-optimized reinforcement ribs with 5 mm fillet welds using ER316L filler"
  - node_2:
      trigger: "Helium permeation rate &gt; 1e-9 mbar·L/s through 10 mm thick aluminum 6061-T6"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Double O-ring seal design with 70 durometer Viton gaskets and helium leak detection at 1e-10 mbar·L/s sensitivity"
bom_nodes:
  main-shell:
    type: "component"
    urn: "URN:CNFX:ME:MAIN_SHELL"
    interface_type: "physical-logic-coupled"
  flanges:
    type: "component"
    urn: "URN:CNFX:ME:FLANGES"
    interface_type: "physical-logic-coupled"
  support-structurefeet:
    type: "component"
    urn: "URN:CNFX:ME:SUPPORT_STRUCTUREFEET"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 21358:2020 VACUUM TECHNOLOGY - VACUUM GAUGES - CALIBRATION OF DIAPHRAGM VACUUM GAUGES"
    scope: "Verified Engineering Specification"
  - standard: "DIN 28400-1:2016 VACUUM TECHNOLOGY - TERMS AND DEFINITIONS - PART 1: GENERAL TERMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/vacuum-chamber-body.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "a9fe8a8a7bbbb8889b09db6dd634f886507667ce08fe8aa6ed5436aa998be3b4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Vacuum Chamber Body

## 1. Technical Definition
The main structural enclosure of a vacuum chamber designed to maintain a controlled low-pressure environment.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1e-6 to 1e-3 mbar (1e-4 to 0.1 Pa)**. Failure boundary: **1.0 mbar (100 Pa) internal pressure differential exceeding 0.5 bar (50 kPa) external pressure**, Mechanism: **Buckling instability due to Euler critical load exceeding material yield strength (σ_y ≥ 250 MPa for 316L stainless steel) at pressure differential ΔP &gt; 50 kPa**.

### 2.1 Analytical Physics Model
Governed by the **Thin-Wall Pressure Vessel Stress Analysis**:

> **Primary Equation**: $\sigma_h = \frac{P \cdot D}{2t}$  
> **Engineering Impact**: Determines the hoop stress boundary to prevent rupture.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| P | Internal Pressure | Engineering Constant |
| D | Diameter | Engineering Constant |
| t | Wall Thickness | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Cyclic thermal stress from 293K to 473K bakeout cycles | 8 | Fatigue crack propagation at weld joints exceeding 2 mm length | Finite element analysis-optimized reinforcement ribs with 5 mm fillet welds using ER316L filler |
| Helium permeation rate &gt; 1e-9 mbar·L/s through 10 mm thick aluminum 6061-T6 | 8 | Pressure rise to 5e-4 mbar within 24 hours violating Class 100 cleanroom spec | Double O-ring seal design with 70 durometer Viton gaskets and helium leak detection at 1e-10 mbar·L/s sensitivity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vacuum Pump System**, **Leak Detection System**, **Process Gas Supply System**  
**Downstream Applications**: Semiconductor Wafers, Optical Coatings, Thin Film Displays  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What stainless steel grades are recommended for vacuum chamber bodies in electronic manufacturing?
**A**: 304 and 316L stainless steel are commonly used for vacuum chamber bodies in electronic manufacturing due to their excellent corrosion resistance, low outgassing properties, and compatibility with high-vacuum environments.

### Q: How does the vacuum chamber body maintain a controlled low-pressure environment?
**A**: The vacuum chamber body provides a sealed structural enclosure that, when combined with vacuum pumps and sealing components, creates and maintains controlled low-pressure environments essential for processes like semiconductor fabrication, optical coating, and electronic component testing.

### Q: What are the key components included in a vacuum chamber body assembly?
**A**: A complete vacuum chamber body assembly typically includes the main shell enclosure, flanges for port connections and sealing, and support structure/feet for stability, all manufactured from high-quality stainless steel for optimal performance in electronic manufacturing applications.

## 6. Manufacturing Compliance
- ISO 21358:2020 VACUUM TECHNOLOGY - VACUUM GAUGES - CALIBRATION OF DIAPHRAGM VACUUM GAUGES
- DIN 28400-1:2016 VACUUM TECHNOLOGY - TERMS AND DEFINITIONS - PART 1: GENERAL TERMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Vacuum Chamber Body](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/vacuum-chamber-body)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: VACUUM_CHAMBER_BODY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 10db9a80
