---
title: "Vibration Sensor Interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:VIBRATION_SENSOR_INTERFACE"
  data_integrity_hash: "9e1bf27b8f3449a4e1a47898e3954603"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:VIBRATION_SENSOR_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/vibration-sensor-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/vibration-sensor-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-1000 Hz frequency, 0-10 VDC output, -40°C to 85°C ambient temperature"
    unit: "Hz"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "VDC"
    consequence: "Dielectric breakdown in operational amplifiers due to overvoltage exceeding semiconductor junction breakdown voltage of 12 V"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diode array (SMBJ5.0A) with 5 V clamping voltage on all sensor input lines"
  - node_2:
      trigger: "Thermal cycling between -40°C and 85°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SnAgCu (SAC305) lead-free solder with 0.5 mm pad-to-component ratio"
bom_nodes:
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
  connector-port:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_PORT"
    interface_type: "physical-logic-coupled"
  microcontroller-interface:
    type: "part"
    urn: "URN:CNFX:ME:MICROCONTROLLER_INTERFACE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/vibration-sensor-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8c3e0c259fb00c631ad2d2e88a6807908d99f344c025b4ca5730e0ce7512e553"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Vibration Sensor Interface

## 1. Technical Definition
Electronic interface component that connects vibration sensors to control systems within an Electronic Assembly Module.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-1000 Hz frequency, 0-10 VDC output, -40°C to 85°C ambient temperature**. Failure boundary: **Input voltage exceeding 15 VDC causes permanent damage to signal conditioning circuitry**, Mechanism: **Dielectric breakdown in operational amplifiers due to overvoltage exceeding semiconductor junction breakdown voltage of 12 V**.

### 2.1 Analytical Physics Model
Governed by the **Harmonic Vibration Force Generation**:

> **Primary Equation**: $F_e = m \cdot r \cdot \omega^2 \sin(\omega t)$  
> **Engineering Impact**: Calculates centrifugal force for vibratory sifters/feeders.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| m | Eccentric Mass | Engineering Constant |
| r | Radius | Engineering Constant |
| \omega | Angular Frequency | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV | 8 | Signal conditioning IC catastrophic failure with 0 VDC output | TVS diode array (SMBJ5.0A) with 5 V clamping voltage on all sensor input lines |
| Thermal cycling between -40°C and 85°C at 10 cycles/hour | 8 | Solder joint fatigue causing intermittent signal loss | SnAgCu (SAC305) lead-free solder with 0.5 mm pad-to-component ratio |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | Hz | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`
- [Microcontroller Interface](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/microcontroller-interface.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Signal Conditioner**, **Data Acquisition System**, **Industrial Computer**  
**Downstream Applications**: Industrial Monitoring Systems, Predictive Maintenance Equipment, Automated Quality Control Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this vibration sensor interface?
**A**: This interface component connects vibration sensors to control systems within electronic assembly modules, providing signal conditioning and reliable data transmission for monitoring mechanical vibrations in manufacturing equipment.

### Q: What materials are used in the construction of this interface?
**A**: The interface is built using a Printed Circuit Board (PCB) with electronic components including ICs, resistors, and capacitors, housed in a durable connector housing for industrial environments.

### Q: How does this interface integrate with existing control systems?
**A**: The interface features a microcontroller interface and connector port that allows seamless integration with PLCs, SCADA systems, and other industrial control architectures commonly used in computer and electronic manufacturing.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Vibration Sensor Interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/vibration-sensor-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: VIBRATION_SENSOR_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: f834d5b1
