---
title: "Wireless Communication Board"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:WIRELESS_COMMUNICATION_BOARD"
  data_integrity_hash: "ce04fa91e27063bb06d9605791e9a19e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:WIRELESS_COMMUNICATION_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-board.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.4-5.0 GHz frequency band, -40 to +85°C ambient temperature, 3.3V ±5% supply voltage"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 10
    unit: "dBm"
    consequence: "Dielectric breakdown in PCB substrate at 150 V/mm, solder joint fatigue due to coefficient of thermal expansion mismatch (Δα = 15 ppm/°C), semiconductor junction degradation at 125°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5 ns response time and 15 pF capacitance at all I/O ports"
  - node_2:
      trigger: "Thermal cycling between -40°C and +85°C at 2 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 solder alloy with 0.5 mm standoff height and corner reinforcement"
bom_nodes:
  microcontroller-unit:
    type: "part"
    urn: "URN:CNFX:ME:MICROCONTROLLER_UNIT"
    interface_type: "physical-logic-coupled"
  wireless-transceiver-module:
    type: "part"
    urn: "URN:CNFX:ME:WIRELESS_TRANSCEIVER_MODULE"
    interface_type: "physical-logic-coupled"
  power-regulation-circuit:
    type: "part"
    urn: "URN:CNFX:ME:POWER_REGULATION_CIRCUIT"
    interface_type: "physical-logic-coupled"
  antenna:
    type: "component"
    urn: "URN:CNFX:ME:ANTENNA"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO/IEC 17025:2017 - GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING PER DIRECTIVE 2014/53/EU (RADIO EQUIPMENT DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "7df502bf037b31e0ded3901ebbca68119149bc429e3444a8f8e8e368545e5c8b"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Wireless Communication Board

## 1. Technical Definition
A printed circuit board (PCB) that enables wireless communication capabilities for smart home electrical systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.4-5.0 GHz frequency band, -40 to +85°C ambient temperature, 3.3V ±5% supply voltage**. Failure boundary: **RF output power drops below -10 dBm, bit error rate exceeds 10^-3, thermal junction temperature reaches 125°C**, Mechanism: **Dielectric breakdown in PCB substrate at 150 V/mm, solder joint fatigue due to coefficient of thermal expansion mismatch (Δα = 15 ppm/°C), semiconductor junction degradation at 125°C**.

### 2.1 Analytical Physics Model
Governed by the **EMI Shielding Effectiveness (SE)**:

> **Primary Equation**: $SE = 20 \log(\frac{E_{in}}{E_{out}})$  
> **Engineering Impact**: Ensures control stability in high-frequency inverter zones.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| E_{in} | Incident Field | Engineering Constant |
| E_{out} | Transmitted Field | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM | 8 | RF front-end IC latch-up causing permanent damage | TVS diodes with 5 ns response time and 15 pF capacitance at all I/O ports |
| Thermal cycling between -40°C and +85°C at 2 cycles/hour | 8 | Solder joint crack propagation leading to intermittent connectivity | SAC305 solder alloy with 0.5 mm standoff height and corner reinforcement |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Microcontroller Unit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/microcontroller-unit.md) `(Standalone System)`
- [Wireless Transceiver Module](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-transceiver-module.md) `(Standalone System)`
- [Power Regulation Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-regulation-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **SMT Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Smart Thermostats, Wireless Security Cameras, Smart Lighting Controllers  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What wireless protocols does this communication board support?
**A**: This wireless communication board supports common protocols like Wi-Fi, Bluetooth, and Zigbee through its integrated wireless module chipset, making it compatible with most smart home ecosystems.

### Q: How does the power regulation circuit enhance board performance?
**A**: The power regulation circuit ensures stable voltage supply to the microcontroller and wireless transceiver, reducing interference and improving signal reliability in varying electrical conditions.

### Q: What are the installation requirements for this PCB in smart home systems?
**A**: Installation requires standard PCB mounting, proper antenna placement for optimal signal range, and integration with existing smart home controllers via the microcontroller unit's programming interface.

## 6. Manufacturing Compliance
- ISO/IEC 17025:2017 - GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES
- CE MARKING PER DIRECTIVE 2014/53/EU (RADIO EQUIPMENT DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Wireless Communication Board](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: WIRELESS_COMMUNICATION_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: d3f78ce6
