---
title: "Wireless Communication Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:WIRELESS_COMMUNICATION_MODULE"
  data_integrity_hash: "51d354cbcefc776071bfd92d4a5988b0"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:WIRELESS_COMMUNICATION_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.4-2.4835 GHz (ISM band), -40°C to +85°C ambient temperature, 3.0-3.6 VDC supply voltage"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 10
    unit: "dBm"
    consequence: "Dielectric breakdown in RF power amplifier at &gt;3.6 VDC, phase noise degradation from crystal oscillator thermal drift beyond ±20 ppm, impedance mismatch causing &gt;1.5 VSWR at antenna port"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM on antenna interface"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated TVS diode array with &lt;1 pF capacitance and spark gap on RF trace"
  - node_2:
      trigger: "Sustained RF power amplifier operation at &gt;20 dBm output for &gt;60 seconds"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Dynamic power back-off algorithm triggered at 105°C baseplate temperature"
bom_nodes:
  rf-transceiver-ic:
    type: "part"
    urn: "URN:CNFX:ME:RF_TRANSCEIVER_IC"
    interface_type: "physical-logic-coupled"
  antenna:
    type: "component"
    urn: "URN:CNFX:ME:ANTENNA"
    interface_type: "physical-logic-coupled"
  power-regulator:
    type: "part"
    urn: "URN:CNFX:ME:POWER_REGULATOR"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO/IEC 17025:2017 (GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI C63.4-2014 (METHODS OF MEASUREMENT OF RADIO-NOISE EMISSIONS FROM LOW-VOLTAGE ELECTRICAL AND ELECTRONIC EQUIPMENT)"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING PER DIRECTIVE 2014/53/EU (RADIO EQUIPMENT DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "3b5ba87fd73a1993045afb3df470b1875ccf59f3b4ec4cdb61aa871d35142774"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Wireless Communication Module

## 1. Technical Definition
A hardware component that enables wireless data transmission between the air quality monitor and other smart home devices or networks.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.4-2.4835 GHz (ISM band), -40°C to +85°C ambient temperature, 3.0-3.6 VDC supply voltage**. Failure boundary: **RF output power drops below -10 dBm, bit error rate exceeds 10^-3 at 1 Mbps data rate, thermal shutdown at 125°C junction temperature**, Mechanism: **Dielectric breakdown in RF power amplifier at &gt;3.6 VDC, phase noise degradation from crystal oscillator thermal drift beyond ±20 ppm, impedance mismatch causing &gt;1.5 VSWR at antenna port**.

### 2.1 Analytical Physics Model
Governed by the **EMI Shielding Effectiveness (SE)**:

> **Primary Equation**: $SE = 20 \log(\frac{E_{in}}{E_{out}})$  
> **Engineering Impact**: Ensures control stability in high-frequency inverter zones.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| E_{in} | Incident Field | Engineering Constant |
| E_{out} | Transmitted Field | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM on antenna interface | 8 | LNA front-end semiconductor junction avalanche breakdown | Integrated TVS diode array with &lt;1 pF capacitance and spark gap on RF trace |
| Sustained RF power amplifier operation at &gt;20 dBm output for &gt;60 seconds | 8 | Thermal runaway leading to solder joint reflow at 217°C eutectic point | Dynamic power back-off algorithm triggered at 105°C baseplate temperature |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [RF Transceiver IC](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/rf-transceiver-ic.md) `(Standalone System)`
- [Power Regulator](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-regulator.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Surface Mount Technology (SMT) Line**, **Automated Optical Inspection (AOI) System**, **RF Testing Chamber**  
**Downstream Applications**: Smart Air Quality Monitors, Home Automation Hubs, Industrial IoT Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What wireless protocols does this communication module support?
**A**: This module typically supports common RF protocols like Zigbee, Z-Wave, or proprietary protocols for smart home integration, with specific protocol compatibility depending on the RF transceiver IC used.

### Q: How does the ceramic antenna compare to PCB trace antennas?
**A**: Ceramic antennas offer better performance in compact designs with higher efficiency, while PCB trace antennas are more cost-effective and integrated directly into the board layout. The choice depends on your size, performance, and budget requirements.

### Q: What is the typical power consumption of this wireless module?
**A**: Power consumption varies by configuration but is typically low-power (often in the milliwatt range) thanks to efficient RF transceiver ICs and power regulators, making it suitable for battery-operated air quality monitors.

## 6. Manufacturing Compliance
- ISO/IEC 17025:2017 (GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES)
- ANSI C63.4-2014 (METHODS OF MEASUREMENT OF RADIO-NOISE EMISSIONS FROM LOW-VOLTAGE ELECTRICAL AND ELECTRONIC EQUIPMENT)
- CE MARKING PER DIRECTIVE 2014/53/EU (RADIO EQUIPMENT DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Wireless Communication Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/wireless-communication-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: WIRELESS_COMMUNICATION_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: bb0ca21f
