---
title: "Heat Sink &amp; Cooling System"
industry: "Electrical Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:HEAT_SINK_COOLING_SYSTEM"
  data_integrity_hash: "d067c7260b632343d552ea87e630b4a8"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HEAT_SINK_COOLING_SYSTEM"
  data_source_uri: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/heat-sink-cooling-system.md"
  official_resource_url: "https://cnfx.com/industry/electrical-equipment-manufacturing/product/heat-sink-cooling-system"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "293.15-353.15 K (20-80°C) surface temperature"
    unit: "W/°C"
engineering_limits:
  max_safe_operating_point:
    value: 398.15
    unit: "K"
    consequence: "Thermal runaway due to positive temperature coefficient of semiconductor resistance, causing exponential power dissipation increase beyond 125°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal interface material degradation below 1.0 W/m·K thermal conductivity"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Phase-change thermal interface material with 3.5 W/m·K conductivity and 0.05 mm bond line thickness"
  - node_2:
      trigger: "Fan bearing wear increasing friction torque above 0.002 N·m"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Dual ball-bearing fans with 50,000 hour MTBF at 60°C ambient temperature"
bom_nodes:
  heat-sink-base:
    type: "component"
    urn: "URN:CNFX:ME:HEAT_SINK_BASE"
    interface_type: "physical-logic-coupled"
  cooling-fins:
    type: "component"
    urn: "URN:CNFX:ME:COOLING_FINS"
    interface_type: "physical-logic-coupled"
  cooling-fan:
    type: "part"
    urn: "URN:CNFX:ME:COOLING_FAN"
    interface_type: "physical-logic-coupled"
  thermal-interface-material:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_INTERFACE_MATERIAL"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/heat-sink-cooling-system.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "26582202fcaa09d86e41e1a1ac43d9fccab1b9ef81af4cf7bfc8278bf9856f75"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Heat Sink &amp; Cooling System

## 1. Technical Definition
A thermal management subsystem within a rectifier power supply that dissipates excess heat generated by electronic components to maintain optimal operating temperatures.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **293.15-353.15 K (20-80°C) surface temperature**. Failure boundary: **398.15 K (125°C) junction temperature for silicon semiconductors**, Mechanism: **Thermal runaway due to positive temperature coefficient of semiconductor resistance, causing exponential power dissipation increase beyond 125°C**.

### 2.1 Analytical Physics Model
Governed by the **LMTD Logarithmic Mean Temperature Difference**:

> **Primary Equation**: $Q = U \cdot A \cdot \Delta T_{lm}$  
> **Engineering Impact**: Sizing validation for pasteurization and cooling tunnels.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| U | Heat Transfer Coeff | Engineering Constant |
| A | Area | Engineering Constant |
| \Delta T_{lm} | LMTD | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal interface material degradation below 1.0 W/m·K thermal conductivity | 8 | Localized hotspot formation exceeding 10 K/mm thermal gradient | Phase-change thermal interface material with 3.5 W/m·K conductivity and 0.05 mm bond line thickness |
| Fan bearing wear increasing friction torque above 0.002 N·m | 8 | Airflow reduction below 0.5 m³/min at 100 Pa static pressure | Dual ball-bearing fans with 50,000 hour MTBF at 60°C ambient temperature |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | W/°C | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Cooling Fan](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/cooling-fan.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Thermal Interface Material Dispenser**, **Thermal Testing Chamber**, **Automated Assembly Line with Pick-and-Place**  
**Downstream Applications**: Industrial Rectifier Power Supply, High-Power LED Lighting System, Electric Vehicle Charging Station  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this heat sink and cooling system?
**A**: This system utilizes aluminum alloy and copper components with thermal paste/compound for optimal heat transfer and dissipation in electrical equipment applications.

### Q: How does this cooling system maintain optimal operating temperatures?
**A**: The system dissipates excess heat through a combination of heat sink base, cooling fins, and cooling fan, preventing overheating and ensuring reliable performance of electronic components.

### Q: What components are included in the BOM for this thermal management subsystem?
**A**: The bill of materials includes Heat Sink Base, Cooling Fins, Cooling Fan, and Thermal Interface Material, providing a complete solution for rectifier power supply cooling needs.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Heat Sink &amp; Cooling System](https://cnfx.com/industry/electrical-equipment-manufacturing/product/heat-sink-cooling-system)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HEAT_SINK_COOLING_SYSTEM | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 95296d41
