---
title: "Relay Board"
industry: "Electrical Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:RELAY_BOARD"
  data_integrity_hash: "4518b6b18a1a5f2ba29e79cb5d1bf9b2"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:RELAY_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relay-board.md"
  official_resource_url: "https://cnfx.com/industry/electrical-equipment-manufacturing/product/relay-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "5-30 VDC coil voltage, 0.1-10 A switching current, -40°C to +85°C ambient temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 35
    unit: "VDC"
    consequence: "Dielectric breakdown at 3 kV/mm electric field strength, contact erosion from arc energy exceeding 50 mJ per operation, thermal expansion mismatch between FR-4 substrate (CTE 14 ppm/°C) and copper traces (CTE 17 ppm/°C)"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Inductive load switching without snubber circuit"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "RC snubber network with 100 Ω resistor and 0.1 μF capacitor rated for 400 V"
  - node_2:
      trigger: "Coil voltage applied beyond rated duty cycle"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "PTC thermistor protection with 85°C trip temperature in series with coil"
bom_nodes:
  pcb:
    type: "part"
    urn: "URN:CNFX:ME:PCB"
    interface_type: "physical-logic-coupled"
  relays:
    type: "part"
    urn: "URN:CNFX:ME:RELAYS"
    interface_type: "physical-logic-coupled"
  terminal-blocks:
    type: "part"
    urn: "URN:CNFX:ME:TERMINAL_BLOCKS"
    interface_type: "physical-logic-coupled"
  led-indicators:
    type: "component"
    urn: "URN:CNFX:ME:LED_INDICATORS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "IEC 61810-1:2015 - ELECTROMECHANICAL ELEMENTARY RELAYS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - EMC DIRECTIVE 2014/30/EU AND LOW VOLTAGE DIRECTIVE 2014/35/EU"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relay-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "98a5b9c8691662b2b18d36388e0b6bad6b89b0255626a7b77a2071631434ba88"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Relay Board

## 1. Technical Definition
A printed circuit board assembly containing multiple electromechanical or solid-state relays for switching electrical circuits in industrial control systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **5-30 VDC coil voltage, 0.1-10 A switching current, -40°C to +85°C ambient temperature**. Failure boundary: **Coil voltage exceeding 35 VDC causes insulation breakdown, contact current surpassing 12 A produces arc welding, ambient temperature above 90°C degrades epoxy encapsulation**, Mechanism: **Dielectric breakdown at 3 kV/mm electric field strength, contact erosion from arc energy exceeding 50 mJ per operation, thermal expansion mismatch between FR-4 substrate (CTE 14 ppm/°C) and copper traces (CTE 17 ppm/°C)**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Inductive load switching without snubber circuit | 8 | Contact welding due to back-EMF exceeding 300 V | RC snubber network with 100 Ω resistor and 0.1 μF capacitor rated for 400 V |
| Coil voltage applied beyond rated duty cycle | 8 | Thermal runaway in coil winding reaching 120°C | PTC thermistor protection with 85°C trip temperature in series with coil |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [PCB](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pcb.md) `(Standalone System)`
- [Relays](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relays.md) `(Standalone System)`
- [Terminal Blocks](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/terminal-blocks.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Optical Inspection System**, **Wave Soldering Machine**, **Pick-and-Place Machine**  
**Downstream Applications**: Industrial Control Panels, Motor Control Centers, Programmable Logic Controller Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the typical application for this relay board?
**A**: This relay board is designed for industrial control systems in electrical equipment manufacturing, used for switching multiple electrical circuits in automation, machinery control, and process monitoring applications.

### Q: What materials are used in the construction of this relay board?
**A**: The board is built on an FR-4 PCB substrate with copper traces, featuring electromechanical or solid-state relays, terminal blocks for connections, and solder for component assembly, ensuring durability in industrial environments.

### Q: What components are included in the bill of materials (BOM)?
**A**: The BOM includes the printed circuit board (PCB), electromechanical or solid-state relays, terminal blocks for secure wiring connections, and LED indicators for status monitoring of each relay channel.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- IEC 61810-1:2015 - ELECTROMECHANICAL ELEMENTARY RELAYS
- CE MARKING - EMC DIRECTIVE 2014/30/EU AND LOW VOLTAGE DIRECTIVE 2014/35/EU

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Relay Board](https://cnfx.com/industry/electrical-equipment-manufacturing/product/relay-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: RELAY_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2cc0b28a
