---
title: "Relay Output Board"
industry: "Electrical Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:RELAY_OUTPUT_BOARD"
  data_integrity_hash: "4e6c40f146d7b49a594f6db6ae4371e1"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:RELAY_OUTPUT_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relay-output-board.md"
  official_resource_url: "https://cnfx.com/industry/electrical-equipment-manufacturing/product/relay-output-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-30 VDC switching voltage, 0-2 A switching current, -20°C to +85°C ambient temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 2.5
    unit: "A"
    consequence: "Electromagnetic relay contact welding due to joule heating (I²R) exceeding 5 W dissipation, dielectric breakdown at 50 VDC/mm in FR-4 substrate"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Inductive load back-EMF exceeding 50 V during relay de-energization"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Snubber circuit with 100 Ω resistor and 0.1 μF capacitor in parallel with relay contacts"
  - node_2:
      trigger: "Ambient humidity exceeding 85% RH at 40°C for &gt;1000 hours"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with 25 μm acrylic layer (IPC-CC-830B Class 3)"
bom_nodes:
  pcb:
    type: "part"
    urn: "URN:CNFX:ME:PCB"
    interface_type: "physical-logic-coupled"
  relays:
    type: "part"
    urn: "URN:CNFX:ME:RELAYS"
    interface_type: "physical-logic-coupled"
  terminal-blocks:
    type: "part"
    urn: "URN:CNFX:ME:TERMINAL_BLOCKS"
    interface_type: "physical-logic-coupled"
  driver-circuitry:
    type: "component"
    urn: "URN:CNFX:ME:DRIVER_CIRCUITRY"
    interface_type: "physical-logic-coupled"
  protection-components:
    type: "component"
    urn: "URN:CNFX:ME:PROTECTION_COMPONENTS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "IEC 61810-1:2015 - ELECTROMECHANICAL ELEMENTARY RELAYS"
    scope: "Verified Engineering Specification"
  - standard: "EN 61010-1:2010 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relay-output-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "337862ef7c60ccef2713019d6c9ee747bef5553c72db9146dec062a86343af06"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Relay Output Board

## 1. Technical Definition
A circuit board containing relay components that provides switching output signals for controlling external devices in a humidity control system.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-30 VDC switching voltage, 0-2 A switching current, -20°C to +85°C ambient temperature**. Failure boundary: **Contact welding at 2.5 A continuous current, insulation breakdown at 50 VDC, relay coil burnout at 125% rated voltage for 100 ms**, Mechanism: **Electromagnetic relay contact welding due to joule heating (I²R) exceeding 5 W dissipation, dielectric breakdown at 50 VDC/mm in FR-4 substrate**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Inductive load back-EMF exceeding 50 V during relay de-energization | 8 | Contact arcing causing carbon deposition and increased contact resistance from 50 mΩ to &gt;500 mΩ | Snubber circuit with 100 Ω resistor and 0.1 μF capacitor in parallel with relay contacts |
| Ambient humidity exceeding 85% RH at 40°C for &gt;1000 hours | 8 | Electrochemical migration forming dendrites between 0.5 mm pitch traces | Conformal coating with 25 μm acrylic layer (IPC-CC-830B Class 3) |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [PCB](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pcb.md) `(Standalone System)`
- [Relays](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/relays.md) `(Standalone System)`
- [Terminal Blocks](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/terminal-blocks.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wave Soldering Machine**, **Automated Optical Inspection System**, **Environmental Test Chamber**  
**Downstream Applications**: Humidity Control System, Industrial Dehumidifier, Climate Control Cabinet  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the difference between electromechanical and solid-state relays on this board?
**A**: Electromechanical relays use physical contacts for switching and handle higher currents, while solid-state relays use semiconductor components for faster, silent operation with longer lifespan but typically lower current ratings.

### Q: How does this relay board integrate with humidity control systems?
**A**: The board receives low-voltage control signals from the humidity controller and uses relays to switch higher-power devices like humidifiers, dehumidifiers, fans, or alarms based on humidity thresholds.

### Q: What protection features are included for reliable operation?
**A**: Standard protection includes flyback diodes for inductive loads, surge suppression, overcurrent protection, and isolation between control and load circuits to prevent damage from voltage spikes.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- IEC 61810-1:2015 - ELECTROMECHANICAL ELEMENTARY RELAYS
- EN 61010-1:2010 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Relay Output Board](https://cnfx.com/industry/electrical-equipment-manufacturing/product/relay-output-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: RELAY_OUTPUT_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 930d010b
