---
title: "Automated Die Attach Machine"
industry: "Electronic Component Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:AUTOMATED_DIE_ATTACH_MACHINE"
  data_integrity_hash: "96c6508e86fcd3e7d8442b106331c5ce"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:AUTOMATED_DIE_ATTACH_MACHINE"
  data_source_uri: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/automated-die-attach-machine.md"
  official_resource_url: "https://cnfx.com/industry/electronic-component-manufacturing/product/automated-die-attach-machine"
  is_verified_logic: true
attributes:
  throughput_rate:
    status: "config-dependent"
    typical_range: "0.5-5.0 N bonding force, 150-250°C bonding temperature, 10-100 μm placement accuracy"
    unit: "UPH"
  bond_force_range:
    status: "config-dependent"
    typical_range: "0.5-5.0 N bonding force, 150-250°C bonding temperature, 10-100 μm placement accuracy"
    unit: "N"
  temperature_range:
    status: "config-dependent"
    typical_range: "150-250°C"
    unit: "°C"
  placement_accuracy:
    status: "config-dependent"
    typical_range: "0.5-5.0 N bonding force, 150-250°C bonding temperature, 10-100 μm placement accuracy"
    unit: "μm"
engineering_limits:
  max_safe_operating_point:
    value: 7.0
    unit: "N"
    consequence: "Silicon die fracture at 7.0 N due to tensile stress exceeding 300 MPa yield strength, insufficient thermal energy below 140°C prevents Au-Si eutectic formation at 363°C melting point, misalignment &gt;150 μm exceeds bond pad dimensions creating non-contact"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Capillary tool wear exceeding 50 μm tip deformation"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Diamond-coated tungsten carbide capillaries with 2000 HV hardness and automated optical inspection every 500 cycles"
  - node_2:
      trigger: "Epoxy bleed-out exceeding 150 μm beyond die perimeter"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Precision dispense system with 0.5 pL resolution and 25°C ±0.5°C epoxy temperature control"
bom_nodes:
  pickup-head:
    type: "part"
    urn: "URN:CNFX:ME:PICKUP_HEAD"
    interface_type: "physical-logic-coupled"
  bonding-tool:
    type: "part"
    urn: "URN:CNFX:ME:BONDING_TOOL"
    interface_type: "physical-logic-coupled"
  vision-alignment-system:
    type: "part"
    urn: "URN:CNFX:ME:VISION_ALIGNMENT_SYSTEM"
    interface_type: "physical-logic-coupled"
  heating-stage:
    type: "part"
    urn: "URN:CNFX:ME:HEATING_STAGE"
    interface_type: "physical-logic-coupled"
  dispenser-unit:
    type: "part"
    urn: "URN:CNFX:ME:DISPENSER_UNIT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - MACHINERY DIRECTIVE 2006/42/EC"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/automated-die-attach-machine.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "b3d93ffbc01e5162879ccee3ecf912f2366a4b66d78d1fcb015bf245bf9fe875"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Automated Die Attach Machine

## 1. Technical Definition
Industrial machine for precisely placing and bonding semiconductor dies onto substrates

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-5.0 N bonding force, 150-250°C bonding temperature, 10-100 μm placement accuracy**. Failure boundary: **Bonding force exceeding 7.0 N causes die fracture, temperature below 140°C prevents eutectic bonding, placement error &gt;150 μm creates electrical open circuits**, Mechanism: **Silicon die fracture at 7.0 N due to tensile stress exceeding 300 MPa yield strength, insufficient thermal energy below 140°C prevents Au-Si eutectic formation at 363°C melting point, misalignment &gt;150 μm exceeds bond pad dimensions creating non-contact**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Capillary tool wear exceeding 50 μm tip deformation | 8 | Inconsistent wire bonding with &gt;30% bond strength variation | Diamond-coated tungsten carbide capillaries with 2000 HV hardness and automated optical inspection every 500 cycles |
| Epoxy bleed-out exceeding 150 μm beyond die perimeter | 8 | Electrical short circuits between adjacent bond pads | Precision dispense system with 0.5 pL resolution and 25°C ±0.5°C epoxy temperature control |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| throughput_rate | Config-dependent | UPH | Verified |
| bond_force_range | Config-dependent | N | Verified |
| temperature_range | Config-dependent | °C | Verified |
| placement_accuracy | Config-dependent | μm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Pickup Head](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pickup-head.md) `(Standalone System)`
- [Bonding Tool](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bonding-tool.md) `(Standalone System)`
- [Vision Alignment System](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/vision-alignment-system.md) `(Standalone System)`
- [Heating Stage](https://cnfx.com/llms/industry/electronic-component-manufacturing/product/heating-stage.md) `(Standalone System)`
- [Dispenser Unit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/dispenser-unit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wafer Dicing Saw**, **Die Bonding Epoxy Dispenser**, **Curing Oven**  
**Downstream Applications**: Microprocessors, Memory Chips, Power Semiconductor Modules  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the typical placement accuracy of this automated die attach machine?
**A**: This machine offers micron-level placement accuracy, typically in the range of ±5-10μm, ensuring precise alignment of semiconductor dies onto substrates for reliable bonding.

### Q: What materials can this die attach machine handle?
**A**: The machine is constructed from durable materials including stainless steel, aluminum alloy, and ceramic components, with polymer seals for contamination control. It can process various die materials commonly used in semiconductor manufacturing.

### Q: How does the vision alignment system improve die attach quality?
**A**: The integrated vision alignment system provides high-resolution imaging and pattern recognition, enabling automatic correction of die position and orientation before bonding, resulting in higher yield and consistent assembly quality.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - MACHINERY DIRECTIVE 2006/42/EC

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Automated Die Attach Machine](https://cnfx.com/industry/electronic-component-manufacturing/product/automated-die-attach-machine)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: AUTOMATED_DIE_ATTACH_MACHINE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 5fb7c96e
