---
title: "High-Density Interconnect (HDI) PCB Substrate"
industry: "Electronic Component Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:HIGH_DENSITY_INTERCONNECT_HDI_PCB_SUBSTRATE"
  data_integrity_hash: "24506d22bade6db2b792099acbb9764a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HIGH_DENSITY_INTERCONNECT_HDI_PCB_SUBSTRATE"
  data_source_uri: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/high-density-interconnect-hdi-pcb-substrate.md"
  official_resource_url: "https://cnfx.com/industry/electronic-component-manufacturing/product/high-density-interconnect-hdi-pcb-substrate"
  is_verified_logic: true
attributes:
  layer_count:
    status: "config-dependent"
    typical_range: "0.1-2.0 mm substrate thickness, 25-150 μm line/space width, 0.15-0.25 mm via diameter"
    unit: "layers"
  minimum_trace_width:
    status: "config-dependent"
    typical_range: "0.1-2.0 mm substrate thickness, 25-150 μm line/space width, 0.15-0.25 mm via diameter"
    unit: "μm"
engineering_limits:
  max_safe_operating_point:
    value: 260
    unit: "°C"
    consequence: "Coefficient of thermal expansion mismatch between copper (17 ppm/°C) and FR-4 epoxy (14-17 ppm/°C in-plane, 50-70 ppm/°C through-plane) causing interfacial stress"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal cycling from -40°C to 125°C at 1000 cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Sequential lamination with filled vias using 65% copper-filled epoxy"
  - node_2:
      trigger: "Electromigration at current density &gt;10^5 A/cm²"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Electroless nickel immersion gold (ENIG) finish with 3-5 μm nickel barrier layer"
bom_nodes:
  copper-conductive-layers:
    type: "component"
    urn: "URN:CNFX:ME:COPPER_CONDUCTIVE_LAYERS"
    interface_type: "physical-logic-coupled"
  dielectric-core-material:
    type: "component"
    urn: "URN:CNFX:ME:DIELECTRIC_CORE_MATERIAL"
    interface_type: "physical-logic-coupled"
  plated-through-holes:
    type: "component"
    urn: "URN:CNFX:ME:PLATED_THROUGH_HOLES"
    interface_type: "physical-logic-coupled"
  solder-mask-layer:
    type: "component"
    urn: "URN:CNFX:ME:SOLDER_MASK_LAYER"
    interface_type: "physical-logic-coupled"
  surface-finish:
    type: "component"
    urn: "URN:CNFX:ME:SURFACE_FINISH"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015: QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/high-density-interconnect-hdi-pcb-substrate.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "380d6ac17f6ad6c0175d9f16847d4fb28d4c4c331d9310efbe1af68bde12312d"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: High-Density Interconnect (HDI) PCB Substrate

## 1. Technical Definition
Advanced printed circuit board substrate enabling miniaturized electronic component integration

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-2.0 mm substrate thickness, 25-150 μm line/space width, 0.15-0.25 mm via diameter**. Failure boundary: **Delamination at 260°C for 10 seconds (lead-free reflow), copper peel strength &lt;0.8 N/mm, dielectric breakdown at &gt;100 kV/mm**, Mechanism: **Coefficient of thermal expansion mismatch between copper (17 ppm/°C) and FR-4 epoxy (14-17 ppm/°C in-plane, 50-70 ppm/°C through-plane) causing interfacial stress**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal cycling from -40°C to 125°C at 1000 cycles | 8 | Microvia barrel cracking at 45° angle fracture plane | Sequential lamination with filled vias using 65% copper-filled epoxy |
| Electromigration at current density &gt;10^5 A/cm² | 8 | Conductive filament formation between adjacent traces | Electroless nickel immersion gold (ENIG) finish with 3-5 μm nickel barrier layer |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| layer_count | Config-dependent | layers | Verified |
| minimum_trace_width | Config-dependent | μm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Laser Direct Imaging System**, **Automated Optical Inspection System**, **Vacuum Lamination Press**  
**Downstream Applications**: Smartphones, Wearable Medical Devices, Automotive ADAS Modules  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key advantages of HDI PCB substrates for electronic component manufacturing?
**A**: HDI PCB substrates enable higher component density, improved signal integrity, and reduced size/weight through finer traces, microvias, and multiple conductive layers, supporting advanced miniaturization in electronics.

### Q: How does dielectric thickness affect HDI PCB substrate performance?
**A**: Dielectric thickness impacts impedance control, signal speed, and thermal management. Thinner dielectrics allow tighter layer stacking for miniaturization, while proper selection ensures reliability and electrical performance in HDI designs.

### Q: What materials are commonly used in HDI PCB substrates and why?
**A**: Common materials include FR-4 epoxy laminate for cost-effective rigidity, polyimide film for flexibility and high-temperature resistance, copper foil for conductivity, and solder mask for protection. These enable durable, high-performance substrates for dense electronic integration.

## 6. Manufacturing Compliance
- ISO 9001:2015: QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: High-Density Interconnect (HDI) PCB Substrate](https://cnfx.com/industry/electronic-component-manufacturing/product/high-density-interconnect-hdi-pcb-substrate)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HIGH_DENSITY_INTERCONNECT_HDI_PCB_SUBSTRATE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 76ca4b79
