---
title: "High-Frequency Ceramic Capacitor"
industry: "Electronic Component Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:HIGH_FREQUENCY_CERAMIC_CAPACITOR"
  data_integrity_hash: "64704b119bbade9cd6d515e5c182e185"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HIGH_FREQUENCY_CERAMIC_CAPACITOR"
  data_source_uri: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/high-frequency-ceramic-capacitor.md"
  official_resource_url: "https://cnfx.com/industry/electronic-component-manufacturing/product/high-frequency-ceramic-capacitor"
  is_verified_logic: true
attributes:
  primary_spec:
    status: "config-dependent"
    typical_range: "1 pF to 100 μF capacitance, -55°C to +125°C temperature, 4 V to 3 kV voltage rating"
    unit: "pF"
  secondary_spec:
    status: "config-dependent"
    typical_range: "1 pF to 100 μF capacitance, -55°C to +125°C temperature, 4 V to 3 kV voltage rating"
    unit: "V"
engineering_limits:
  max_safe_operating_point:
    value: 30
    unit: "kV"
    consequence: "Dielectric polarization saturation at Curie temperature (120-150°C for X7R), piezoelectric stress concentration at grain boundaries, silver migration at &gt;85% RH"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal shock exceeding 100°C/min gradient"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Glass encapsulation with CTE matching alumina (7.2 ppm/°C)"
  - node_2:
      trigger: "AC voltage exceeding 0.5 Vrms at resonant frequency (1-100 MHz)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Multilayer design with distributed ESR &lt;10 mΩ and thermal vias to substrate"
bom_nodes:
  ceramic-dielectric:
    type: "component"
    urn: "URN:CNFX:ME:CERAMIC_DIELECTRIC"
    interface_type: "physical-logic-coupled"
  internal-electrode:
    type: "component"
    urn: "URN:CNFX:ME:INTERNAL_ELECTRODE"
    interface_type: "physical-logic-coupled"
  termination:
    type: "component"
    urn: "URN:CNFX:ME:TERMINATION"
    interface_type: "physical-logic-coupled"
  protective-coating:
    type: "component"
    urn: "URN:CNFX:ME:PROTECTIVE_COATING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/electronic-component-manufacturing/product/high-frequency-ceramic-capacitor.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "20fc53a693918daf7fca8a129f48e5b4cd5df9debf036d7c53270cb131924799"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: High-Frequency Ceramic Capacitor

## 1. Technical Definition
Miniaturized capacitor using ceramic dielectric for high-frequency electronic circuits

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1 pF to 100 μF capacitance, -55°C to +125°C temperature, 4 V to 3 kV voltage rating**. Failure boundary: **Dielectric breakdown at 10-30 kV/mm field strength, mechanical cracking at 0.1% strain, thermal runaway above 150°C**, Mechanism: **Dielectric polarization saturation at Curie temperature (120-150°C for X7R), piezoelectric stress concentration at grain boundaries, silver migration at &gt;85% RH**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal shock exceeding 100°C/min gradient | 8 | Ceramic dielectric microcracking causing capacitance drift &gt;±15% | Glass encapsulation with CTE matching alumina (7.2 ppm/°C) |
| AC voltage exceeding 0.5 Vrms at resonant frequency (1-100 MHz) | 8 | Dielectric heating leading to thermal runaway at 150°C junction temperature | Multilayer design with distributed ESR &lt;10 mΩ and thermal vias to substrate |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| primary_spec | Config-dependent | pF | Verified |
| secondary_spec | Config-dependent | V | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Screen Printing Machine**, **Sintering Furnace**, **Laser Trimming System**  
**Downstream Applications**: RF Communication Modules, Medical Imaging Equipment, Satellite Navigation Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key applications for high-frequency ceramic capacitors?
**A**: High-frequency ceramic capacitors are essential in RF circuits, telecommunications equipment, wireless devices, and high-speed digital circuits where stable capacitance at high frequencies is required.

### Q: How does the ceramic dielectric material affect capacitor performance?
**A**: Barium titanate ceramic provides excellent dielectric properties for high-frequency applications, offering low dissipation factor, high self-resonant frequency, and good temperature stability.

### Q: What advantages do silver palladium terminations provide?
**A**: Silver palladium terminations offer superior solderability, excellent conductivity, and enhanced reliability compared to standard terminations, making them ideal for high-frequency applications.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: High-Frequency Ceramic Capacitor](https://cnfx.com/industry/electronic-component-manufacturing/product/high-frequency-ceramic-capacitor)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HIGH_FREQUENCY_CERAMIC_CAPACITOR | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2ecbe527
