---
title: "Backplane"
industry: "Machinery and Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:BACKPLANE"
  data_integrity_hash: "043ae493514887ce3c0e2086025c4217"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:BACKPLANE"
  data_source_uri: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/backplane.md"
  official_resource_url: "https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/backplane"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-60°C ambient temperature, 85-264 VAC input voltage, 0-95% relative humidity non-condensing"
    unit: "slots"
engineering_limits:
  max_safe_operating_point:
    value: 130
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch between FR-4 substrate (14-17 ppm/°C) and copper traces (16.6 ppm/°C) causing delamination at Tg threshold, electromigration at current densities above 10⁶ A/cm², mechanical fatigue from cyclic thermal stress"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrochemical migration due to ionic contamination exceeding 1.56 μg/cm² NaCl equivalent"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with 25-75 μm acrylic or polyurethane layer, IPC-CC-830B cleanliness standard implementation"
  - node_2:
      trigger: "Vibration-induced fretting at connector interfaces exceeding 15 g RMS acceleration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gold-plated contacts with 0.76 μm minimum thickness, anti-fretting lubricant with 0.5-1.0 cSt viscosity"
bom_nodes:
  pcb-printed-circuit-board:
    type: "component"
    urn: "URN:CNFX:ME:PCB_PRINTED_CIRCUIT_BOARD"
    interface_type: "physical-logic-coupled"
  edge-connectors-slots:
    type: "component"
    urn: "URN:CNFX:ME:EDGE_CONNECTORS_SLOTS"
    interface_type: "physical-logic-coupled"
  bus-traces:
    type: "component"
    urn: "URN:CNFX:ME:BUS_TRACES"
    interface_type: "physical-logic-coupled"
  termination-resistors:
    type: "component"
    urn: "URN:CNFX:ME:TERMINATION_RESISTORS"
    interface_type: "physical-logic-coupled"
  mounting-holes:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_HOLES"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/backplane.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "bdb0ecfdf698d63a3026fd45ff7183ebdce48343ad7f7a8d12860d3c0c45ebc4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Backplane

## 1. Technical Definition
A printed circuit board that provides electrical and mechanical connections for multiple modules in a Programmable Logic Controller (PLC) rack.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-60°C ambient temperature, 85-264 VAC input voltage, 0-95% relative humidity non-condensing**. Failure boundary: **PCB substrate glass transition temperature (Tg) of 130°C, copper trace current density exceeding 35 A/mm², connector mating force exceeding 50 N per contact**, Mechanism: **Thermal expansion coefficient mismatch between FR-4 substrate (14-17 ppm/°C) and copper traces (16.6 ppm/°C) causing delamination at Tg threshold, electromigration at current densities above 10⁶ A/cm², mechanical fatigue from cyclic thermal stress**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrochemical migration due to ionic contamination exceeding 1.56 μg/cm² NaCl equivalent | 8 | Conductive anodic filament growth between adjacent traces at 5 μm/hour rate | Conformal coating with 25-75 μm acrylic or polyurethane layer, IPC-CC-830B cleanliness standard implementation |
| Vibration-induced fretting at connector interfaces exceeding 15 g RMS acceleration | 8 | Contact resistance increase from 5 mΩ to 500 mΩ over 10⁷ cycles | Gold-plated contacts with 0.76 μm minimum thickness, anti-fretting lubricant with 0.5-1.0 cSt viscosity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | slots | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Programmable Logic Controller, Industrial Automation System, Machine Control Panel  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this PLC backplane?
**A**: This backplane is constructed with FR-4 glass epoxy PCB material, copper traces for electrical conductivity, and gold or tin plating on connectors for durability and reliable connections in industrial environments.

### Q: How does a backplane connect modules in a PLC system?
**A**: The backplane provides both electrical and mechanical connections through edge connectors and slots, allowing multiple PLC modules to communicate via bus traces while being securely mounted in the rack.

### Q: What are the key components in a backplane BOM?
**A**: The bill of materials includes the printed circuit board (PCB), edge connectors/slots for module insertion, bus traces for data transmission, termination resistors for signal integrity, and mounting holes for secure installation in machinery.

## 6. Manufacturing Compliance
- ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Backplane](https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/backplane)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: BACKPLANE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: eee1461f
