---
title: "Dependency Resolver"
industry: "Machinery and Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DEPENDENCY_RESOLVER"
  data_integrity_hash: "00ab5faf3b2005bdc3cf665974768c3a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DEPENDENCY_RESOLVER"
  data_source_uri: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/dependency-resolver.md"
  official_resource_url: "https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/dependency-resolver"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 0.8-1.2 VDC supply voltage, 10-1000 ms dependency resolution latency"
    unit: "ms"
engineering_limits:
  max_safe_operating_point:
    value: 85
    unit: "°C"
    consequence: "Semiconductor junction thermal runaway at &gt;85°C causing transistor leakage current doubling per 8-10°C rise (Arrhenius equation), voltage regulator dropout below 0.8 VDC causing CMOS logic state corruption, clock signal jitter &gt;15% at &gt;1.2 VDC leading to metastability in flip-flops"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event of &gt;2000 V human body model (HBM) on I/O pins"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection structures with 1500 Ω series resistors and 8 kV HBM rating, conformal coating with 10¹² Ω-cm surface resistivity"
  - node_2:
      trigger: "Memory bit flip from single event upset (SEU) with linear energy transfer (LET) &gt;10 MeV·cm²/mg"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Triple modular redundancy (TMR) voting logic with 2-out-of-3 consensus, error correcting code (ECC) memory with Hamming distance 4"
bom_nodes:
  dependency-graph-processor:
    type: "part"
    urn: "URN:CNFX:ME:DEPENDENCY_GRAPH_PROCESSOR"
    interface_type: "physical-logic-coupled"
  rule-engine:
    type: "part"
    urn: "URN:CNFX:ME:RULE_ENGINE"
    interface_type: "physical-logic-coupled"
  configuration-parser:
    type: "component"
    urn: "URN:CNFX:ME:CONFIGURATION_PARSER"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/dependency-resolver.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "e161debc5c40181d372a2710986ac637a9ba2228331c4b43ac79d4eb4fa356d4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Dependency Resolver

## 1. Technical Definition
A software or hardware component that identifies and manages dependencies between system elements during recovery operations.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 0.8-1.2 VDC supply voltage, 10-1000 ms dependency resolution latency**. Failure boundary: **Ambient temperature &gt;85°C sustained for &gt;60 minutes, supply voltage &lt;0.8 VDC or &gt;1.2 VDC sustained for &gt;10 ms, dependency resolution latency &gt;1000 ms for &gt;95% of operations**, Mechanism: **Semiconductor junction thermal runaway at &gt;85°C causing transistor leakage current doubling per 8-10°C rise (Arrhenius equation), voltage regulator dropout below 0.8 VDC causing CMOS logic state corruption, clock signal jitter &gt;15% at &gt;1.2 VDC leading to metastability in flip-flops**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event of &gt;2000 V human body model (HBM) on I/O pins | 8 | Gate oxide breakdown in input protection diodes causing permanent short circuit | Integrated ESD protection structures with 1500 Ω series resistors and 8 kV HBM rating, conformal coating with 10¹² Ω-cm surface resistivity |
| Memory bit flip from single event upset (SEU) with linear energy transfer (LET) &gt;10 MeV·cm²/mg | 8 | Corrupted dependency graph causing circular reference detection failure | Triple modular redundancy (TMR) voting logic with 2-out-of-3 consensus, error correcting code (ECC) memory with Hamming distance 4 |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | ms | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Dependency Graph Processor](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/dependency-graph-processor.md) `(Standalone System)`
- [Rule Engine](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/rule-engine.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Industrial Control System**, **Data Acquisition Unit**, **Network Infrastructure Equipment**  
**Downstream Applications**: Automated Assembly Lines, CNC Machining Centers, Industrial Robotics Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: How does the Dependency Resolver improve recovery operations in machinery manufacturing?
**A**: The Dependency Resolver identifies and manages dependencies between system elements during recovery, ensuring proper sequencing and preventing conflicts when restarting or repairing industrial equipment, minimizing downtime.

### Q: What components are included in the Dependency Resolver BOM?
**A**: The Bill of Materials includes a Dependency Graph Processor for mapping relationships, a Rule Engine for managing dependency logic, and a Configuration Parser for interpreting system settings and recovery parameters.

### Q: Can this Dependency Resolver integrate with existing manufacturing equipment systems?
**A**: Yes, it's designed with modular electronic components and software algorithms that can interface with various industrial control systems through standardized protocols and configuration formats.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Dependency Resolver](https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/dependency-resolver)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DEPENDENCY_RESOLVER | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: fb9b7bad
