---
title: "Detection Sensor Head"
industry: "Machinery and Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DETECTION_SENSOR_HEAD"
  data_integrity_hash: "ac3bcdfe5c61fe21933fcbd1cd5ff618"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DETECTION_SENSOR_HEAD"
  data_source_uri: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/detection-sensor-head.md"
  official_resource_url: "https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/detection-sensor-head"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-1000 lux"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 3
    unit: "dB"
    consequence: "Photodiode quantum efficiency degradation due to 125°C junction temperature exceeding silicon's 150°C maximum operating temperature"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM (Human Body Model)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diode clamping at 68 V with 1 pF parasitic capacitance"
  - node_2:
      trigger: "Ambient light interference at 650 nm wavelength exceeding 10000 lux"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "850 nm bandpass optical filter with 20 nm FWHM bandwidth"
bom_nodes:
  coil-assembly:
    type: "part"
    urn: "URN:CNFX:ME:COIL_ASSEMBLY"
    interface_type: "physical-logic-coupled"
  housing:
    type: "component"
    urn: "URN:CNFX:ME:HOUSING"
    interface_type: "physical-logic-coupled"
  connector-interface:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_INTERFACE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU: LOW VOLTAGE DIRECTIVE FOR ELECTRICAL EQUIPMENT)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/detection-sensor-head.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8ec974129b67e56747fa7de27d7dcf791cc19a9b75944977203ab8d8cf4e8a87"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Detection Sensor Head

## 1. Technical Definition
The sensing element of a foreign object detection system that captures detection signals.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-1000 lux**. Failure boundary: **Signal-to-noise ratio &lt; 3 dB at 850 nm wavelength**, Mechanism: **Photodiode quantum efficiency degradation due to 125°C junction temperature exceeding silicon's 150°C maximum operating temperature**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM (Human Body Model) | 8 | Photodiode reverse breakdown at 75 V | TVS diode clamping at 68 V with 1 pF parasitic capacitance |
| Ambient light interference at 650 nm wavelength exceeding 10000 lux | 8 | Photodiode saturation current reaching 100 mA | 850 nm bandpass optical filter with 20 nm FWHM bandwidth |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Coil Assembly](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/coil-assembly.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Signal Processing Unit**, **Power Supply Unit**, **Mounting Bracket System**  
**Downstream Applications**: Automated Sorting Systems, Quality Control Inspection Lines, Safety Interlock Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this detection sensor head?
**A**: This sensor head features a durable stainless steel housing, high-sensitivity ceramic sensing elements, and reliable copper wiring for optimal performance in industrial environments.

### Q: What is the primary function of this detection sensor head?
**A**: It serves as the sensing element in foreign object detection systems, capturing detection signals to identify unwanted materials or objects in machinery and equipment manufacturing processes.

### Q: What components are included in the BOM for this sensor head?
**A**: The bill of materials includes the coil assembly for signal generation, connector interface for system integration, and the protective housing that contains all sensing components.

## 6. Manufacturing Compliance
- CE MARKING (EU DIRECTIVE 2014/35/EU: LOW VOLTAGE DIRECTIVE FOR ELECTRICAL EQUIPMENT)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Detection Sensor Head](https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/detection-sensor-head)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DETECTION_SENSOR_HEAD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2de630a3
