---
title: "Sensing Array"
industry: "Machinery and Equipment Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:SENSING_ARRAY"
  data_integrity_hash: "55ec2b90c37de8cc73f9613611883184"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:SENSING_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/sensing-array.md"
  official_resource_url: "https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/sensing-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-100 kPa differential pressure, -40°C to 85°C ambient temperature, 0-100% relative humidity non-condensing"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 120
    unit: "kPa"
    consequence: "Diaphragm material (316L stainless steel) yields at 120 kPa due to Hooke's Law elastic limit violation, semiconductor junction thermal runaway occurs at 125°C per Arrhenius equation (Ea=0.7 eV), water adsorption on dielectric surfaces reduces permittivity by 30% at 95% RH"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated TVS diodes with 5 ns response time and 15 kV clamping voltage on all I/O lines"
  - node_2:
      trigger: "Mechanical vibration at 200 Hz resonance frequency with 5 g acceleration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating (urethane, 50 μm thickness) and strain relief mounting with 60 Shore A durometer isolators"
bom_nodes:
  sensor-housing:
    type: "component"
    urn: "URN:CNFX:ME:SENSOR_HOUSING"
    interface_type: "physical-logic-coupled"
  sensor-elements:
    type: "component"
    urn: "URN:CNFX:ME:SENSOR_ELEMENTS"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
  connector-cable-gland:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_CABLE_GLAND"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/sensing-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "c6b65b9cfaf56c6193dc0c99465477671700267f1a5efbd4b12aa22e8df4ec87"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Sensing Array

## 1. Technical Definition
A multi-sensor configuration within a component feeding system that detects, identifies, and monitors the position, orientation, and presence of components.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-100 kPa differential pressure, -40°C to 85°C ambient temperature, 0-100% relative humidity non-condensing**. Failure boundary: **Differential pressure exceeding 120 kPa causes diaphragm rupture, temperatures beyond -50°C or 125°C cause sensor drift exceeding 5% FS, humidity above 95% RH causes capacitive coupling failure**, Mechanism: **Diaphragm material (316L stainless steel) yields at 120 kPa due to Hooke's Law elastic limit violation, semiconductor junction thermal runaway occurs at 125°C per Arrhenius equation (Ea=0.7 eV), water adsorption on dielectric surfaces reduces permittivity by 30% at 95% RH**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV HBM | 8 | CMOS sensor IC gate oxide breakdown with 10^6 Ω leakage path | Integrated TVS diodes with 5 ns response time and 15 kV clamping voltage on all I/O lines |
| Mechanical vibration at 200 Hz resonance frequency with 5 g acceleration | 8 | Solder joint fatigue cracking per Coffin-Manson equation (Nf=1000 cycles at Δε=0.2%) | Conformal coating (urethane, 50 μm thickness) and strain relief mounting with 60 Shore A durometer isolators |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Component Feeder System**, **Programmable Logic Controller (PLC)**, **Industrial Vision System**  
**Downstream Applications**: Automated Assembly Lines, Robotic Pick-and-Place Systems, Quality Control Stations  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in the Sensing Array construction?
**A**: The Sensing Array features a durable stainless steel housing for protection, polycarbonate lens/window for clear detection, and high-quality electronic components including sensor elements and PCB for reliable operation in industrial environments.

### Q: How does the Sensing Array improve component feeding system accuracy?
**A**: The multi-sensor configuration simultaneously detects position, orientation, and presence of components, providing comprehensive monitoring that reduces errors, minimizes jams, and ensures precise component placement in automated machinery systems.

### Q: What maintenance is required for the Sensing Array in manufacturing environments?
**A**: The stainless steel housing and polycarbonate lens require only periodic cleaning to maintain optical clarity. Electronic components are designed for long-term reliability with minimal maintenance, though regular system calibration is recommended for optimal performance.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Sensing Array](https://cnfx.com/industry/machinery-and-equipment-manufacturing/product/sensing-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: SENSING_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: e23a34e5
