---
title: "Automated Surface Mount Technology (SMT) Pick-and-Place Machine"
industry: "Manufacture of Consumer Electronics"
verification_protocol:
  urn: "URN:CNFX:ME:AUTOMATED_SURFACE_MOUNT_TECHNOLOGY_SMT_PICK_AND_PLACE_MACHINE"
  data_integrity_hash: "0e7bc418e975b4bac5032c0df126d709"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:AUTOMATED_SURFACE_MOUNT_TECHNOLOGY_SMT_PICK_AND_PLACE_MACHINE"
  data_source_uri: "https://cnfx.com/llms/industry/manufacture-consumer-electronics/product/automated-surface-mount-technology-smt-pick-and-place-machine.md"
  official_resource_url: "https://cnfx.com/industry/manufacture-consumer-electronics/product/automated-surface-mount-technology-smt-pick-and-place-machine"
  is_verified_logic: true
attributes:
  placement_speed:
    status: "config-dependent"
    typical_range: "0.1-1.0 m/s placement velocity, 0.025-0.050 mm placement accuracy, 0.5-5.0 N placement force"
    unit: "components per hour (CPH)"
  placement_accuracy:
    status: "config-dependent"
    typical_range: "0.1-1.0 m/s placement velocity, 0.025-0.050 mm placement accuracy, 0.5-5.0 N placement force"
    unit: "micrometers (µm)"
engineering_limits:
  max_safe_operating_point:
    value: 0.100
    unit: "mm"
    consequence: "Servo motor cogging torque exceeding 0.15 Nm at low speeds, piezoelectric actuator hysteresis exceeding 5% at high frequencies, ball screw thermal expansion exceeding 15 μm/m·°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Servo motor encoder resolution degradation below 20-bit"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Dual redundant absolute encoders with 24-bit resolution and automatic calibration every 1000 cycles"
  - node_2:
      trigger: "Vacuum nozzle Bernoulli effect pressure drop below 40 kPa at 0.8 m/s"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Dual-stage vacuum system with 60 kPa primary and 80 kPa backup, real-time pressure monitoring with 0.1 kPa resolution"
bom_nodes:
  placement-head:
    type: "part"
    urn: "URN:CNFX:ME:PLACEMENT_HEAD"
    interface_type: "physical-logic-coupled"
  xy-gantry-system:
    type: "part"
    urn: "URN:CNFX:ME:XY_GANTRY_SYSTEM"
    interface_type: "physical-logic-coupled"
  vision-system:
    type: "part"
    urn: "URN:CNFX:ME:VISION_SYSTEM"
    interface_type: "physical-logic-coupled"
  feeder-base:
    type: "part"
    urn: "URN:CNFX:ME:FEEDER_BASE"
    interface_type: "physical-logic-coupled"
  conveyor-system:
    type: "part"
    urn: "URN:CNFX:ME:CONVEYOR_SYSTEM"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (MACHINERY DIRECTIVE 2006/42/EC)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/manufacture-consumer-electronics/product/automated-surface-mount-technology-smt-pick-and-place-machine.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "fa5b6ef0afe155006d373244dee5d3759289796b44a4188db844fe303d4f5722"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Automated Surface Mount Technology (SMT) Pick-and-Place Machine

## 1. Technical Definition
Industrial machine for high-speed, precise placement of electronic components onto printed circuit boards.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-1.0 m/s placement velocity, 0.025-0.050 mm placement accuracy, 0.5-5.0 N placement force**. Failure boundary: **Placement accuracy exceeding 0.100 mm, placement velocity below 0.05 m/s or above 1.2 m/s, placement force exceeding 7.0 N**, Mechanism: **Servo motor cogging torque exceeding 0.15 Nm at low speeds, piezoelectric actuator hysteresis exceeding 5% at high frequencies, ball screw thermal expansion exceeding 15 μm/m·°C**.

### 2.1 Analytical Physics Model
Governed by the **Harmonic Vibration Force Generation**:

> **Primary Equation**: $F_e = m \cdot r \cdot \omega^2 \sin(\omega t)$  
> **Engineering Impact**: Calculates centrifugal force for vibratory sifters/feeders.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| m | Eccentric Mass | Engineering Constant |
| r | Radius | Engineering Constant |
| \omega | Angular Frequency | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Servo motor encoder resolution degradation below 20-bit | 8 | Placement positional error accumulation exceeding 0.100 mm over 100 cycles | Dual redundant absolute encoders with 24-bit resolution and automatic calibration every 1000 cycles |
| Vacuum nozzle Bernoulli effect pressure drop below 40 kPa at 0.8 m/s | 8 | Component suction failure rate exceeding 0.1% per placement | Dual-stage vacuum system with 60 kPa primary and 80 kPa backup, real-time pressure monitoring with 0.1 kPa resolution |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| placement_speed | Config-dependent | components per hour (CPH) | Verified |
| placement_accuracy | Config-dependent | micrometers (µm) | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Placement Head](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/placement-head.md) `(Standalone System)`
- [XY Gantry System](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/xy-gantry-system.md) `(Standalone System)`
- [Vision System](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/vision-system.md) `(Standalone System)`
- [Feeder Base](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/feeder-base.md) `(Standalone System)`
- [Conveyor System](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/conveyor-system.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Solder Paste Printer**, **Reflow Oven**, **Automated Optical Inspection (AOI) System**  
**Downstream Applications**: Smartphone Motherboards, Laptop Circuit Boards, Smartwatch PCBs  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the placement accuracy of this SMT pick-and-place machine?
**A**: This machine offers placement accuracy in the micrometer (µm) range, ensuring precise component placement for high-quality consumer electronics PCB assembly.

### Q: How many component feeders can this machine accommodate?
**A**: The machine features a feeder base with multiple slots (exact number configurable), allowing simultaneous handling of various electronic components for efficient production.

### Q: What types of PCBs can this machine handle?
**A**: It accommodates PCBs up to the maximum specified size (in mm), suitable for consumer electronics applications, with a conveyor system for smooth board handling.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (MACHINERY DIRECTIVE 2006/42/EC)

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Automated Surface Mount Technology (SMT) Pick-and-Place Machine](https://cnfx.com/industry/manufacture-consumer-electronics/product/automated-surface-mount-technology-smt-pick-and-place-machine)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: AUTOMATED_SURFACE_MOUNT_TECHNOLOGY_SMT_PICK_AND_PLACE_MACHINE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 8a1e19d2
