---
title: "High-Density HDMI Connector Assembly"
industry: "Manufacture of Consumer Electronics"
verification_protocol:
  urn: "URN:CNFX:ME:HIGH_DENSITY_HDMI_CONNECTOR_ASSEMBLY"
  data_integrity_hash: "b6992d03b4931efe6fd94b22a13c73b0"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HIGH_DENSITY_HDMI_CONNECTOR_ASSEMBLY"
  data_source_uri: "https://cnfx.com/llms/industry/manufacture-consumer-electronics/product/high-density-hdmi-connector-assembly.md"
  official_resource_url: "https://cnfx.com/industry/manufacture-consumer-electronics/product/high-density-hdmi-connector-assembly"
  is_verified_logic: true
attributes:
  primary_spec:
    status: "config-dependent"
    typical_range: "0-5.0 Gbps data rate, -40°C to +85°C temperature, 0-1000 mating cycles"
    unit: "Gbps"
  secondary_spec:
    status: "config-dependent"
    typical_range: "0-5.0 Gbps data rate, -40°C to +85°C temperature, 0-1000 mating cycles"
    unit: "V"
engineering_limits:
  max_safe_operating_point:
    value: 100
    unit: "m"
    consequence: "Electromigration at current densities &gt; 10⁶ A/cm² causing contact degradation, plastic deformation exceeding yield strength of phosphor bronze (415 MPa), dielectric polarization breakdown at 15 kV/mm"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Differential pair skew exceeding 150 ps causing intersymbol interference"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Impedance-controlled routing with 100Ω ±10% differential impedance and length matching within 5 mil"
  - node_2:
      trigger: "Thermal expansion mismatch between FR-4 substrate (CTE 14 ppm/°C) and copper contacts (CTE 17 ppm/°C)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Underfill epoxy application with CTE 25 ppm/°C and glass transition temperature 125°C"
bom_nodes:
  connector-housing:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_HOUSING"
    interface_type: "physical-logic-coupled"
  contact-pins:
    type: "component"
    urn: "URN:CNFX:ME:CONTACT_PINS"
    interface_type: "physical-logic-coupled"
  shielding-shell:
    type: "component"
    urn: "URN:CNFX:ME:SHIELDING_SHELL"
    interface_type: "physical-logic-coupled"
  mounting-brackets:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BRACKETS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/manufacture-consumer-electronics/product/high-density-hdmi-connector-assembly.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "7861abb55df4321da6ad7d4e2882428f3c66f3cb9cf6e9ef57487801aefa0654"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: High-Density HDMI Connector Assembly

## 1. Technical Definition
Compact HDMI connector assembly for high-speed digital video/audio transmission in consumer electronics.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-5.0 Gbps data rate, -40°C to +85°C temperature, 0-1000 mating cycles**. Failure boundary: **Contact resistance exceeding 100 mΩ, insertion force surpassing 50 N, dielectric breakdown at 500 VAC**, Mechanism: **Electromigration at current densities &gt; 10⁶ A/cm² causing contact degradation, plastic deformation exceeding yield strength of phosphor bronze (415 MPa), dielectric polarization breakdown at 15 kV/mm**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Differential pair skew exceeding 150 ps causing intersymbol interference | 8 | Bit error rate degradation beyond 10⁻¹² BER threshold | Impedance-controlled routing with 100Ω ±10% differential impedance and length matching within 5 mil |
| Thermal expansion mismatch between FR-4 substrate (CTE 14 ppm/°C) and copper contacts (CTE 17 ppm/°C) | 8 | Solder joint fatigue cracking after 500 thermal cycles (-40°C to +85°C) | Underfill epoxy application with CTE 25 ppm/°C and glass transition temperature 125°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| primary_spec | Config-dependent | Gbps | Verified |
| secondary_spec | Config-dependent | V | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Soldering System**, **Precision Crimping Machine**, **Optical Inspection System**  
**Downstream Applications**: Smart Televisions, Gaming Consoles, Home Theater Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What makes this HDMI connector assembly suitable for high-speed data transfer?
**A**: This assembly uses phosphor bronze contact pins with nickel plating to ensure low contact resistance and reliable signal integrity, supporting high data transfer rates required for modern digital video/audio transmission.

### Q: How durable is this HDMI connector assembly for repeated use?
**A**: Designed for longevity, this connector assembly undergoes rigorous testing for durability cycles, with a robust housing made from high-temperature plastic and secure mounting brackets to withstand frequent insertions and removals.

### Q: Can this HDMI connector assembly operate in extreme temperature conditions?
**A**: Yes, the assembly is engineered with high-temperature plastic and nickel-plated components to maintain performance across a wide operating temperature range, making it suitable for various consumer electronics environments.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: High-Density HDMI Connector Assembly](https://cnfx.com/industry/manufacture-consumer-electronics/product/high-density-hdmi-connector-assembly)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HIGH_DENSITY_HDMI_CONNECTOR_ASSEMBLY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2946b908
