---
title: "Precision Heat Sink Assembly"
industry: "Manufacture of Lighting Equipment"
verification_protocol:
  urn: "URN:CNFX:ME:PRECISION_HEAT_SINK_ASSEMBLY"
  data_integrity_hash: "07932dd32631b882fc1631439edf5aaf"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PRECISION_HEAT_SINK_ASSEMBLY"
  data_source_uri: "https://cnfx.com/llms/industry/manufacture-lighting-equipment/product/precision-heat-sink-assembly.md"
  official_resource_url: "https://cnfx.com/industry/manufacture-lighting-equipment/product/precision-heat-sink-assembly"
  is_verified_logic: true
attributes:
  surface_area:
    status: "config-dependent"
    typical_range: "15-85°C baseplate temperature"
    unit: "cm²"
  thermal_resistance:
    status: "config-dependent"
    typical_range: "15-85°C baseplate temperature"
    unit: "°C/W"
engineering_limits:
  max_safe_operating_point:
    value: 105
    unit: "°C"
    consequence: "Thermal interface material degradation above glass transition temperature (Tg=110°C for silicone-based TIMs), reducing thermal conductivity from 3.5 W/m·K to &lt;0.5 W/m·K"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal cycling stress (ΔT=60°C, 1000 cycles)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-core solder joints with 0.3mm standoff height and corner fillets"
  - node_2:
      trigger: "Aluminum fin corrosion in chloride environments (&gt;500ppm Cl⁻)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Anodized aluminum fins with 25μm coating thickness and hydrophobic surface treatment"
bom_nodes:
  base-plate:
    type: "component"
    urn: "URN:CNFX:ME:BASE_PLATE"
    interface_type: "physical-logic-coupled"
  cooling-fins:
    type: "component"
    urn: "URN:CNFX:ME:COOLING_FINS"
    interface_type: "physical-logic-coupled"
  mounting-brackets:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BRACKETS"
    interface_type: "physical-logic-coupled"
  thermal-interface-pad:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_INTERFACE_PAD"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASME Y14.5-2018 - DIMENSIONING AND TOLERANCING"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 1676:1997 - ALUMINIUM AND ALUMINIUM ALLOYS - EXTRUDED ROD/BAR, TUBE AND PROFILES"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/manufacture-lighting-equipment/product/precision-heat-sink-assembly.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "32b48a4bbba9b7f8ea008aa849af6b11262202ce4990a8e82f2bf1865bb504a0"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Precision Heat Sink Assembly

## 1. Technical Definition
Thermal management component for LED lighting systems that dissipates heat from electronic drivers.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **15-85°C baseplate temperature**. Failure boundary: **105°C baseplate temperature sustained for 30 minutes**, Mechanism: **Thermal interface material degradation above glass transition temperature (Tg=110°C for silicone-based TIMs), reducing thermal conductivity from 3.5 W/m·K to &lt;0.5 W/m·K**.

### 2.1 Analytical Physics Model
Governed by the **LMTD Logarithmic Mean Temperature Difference**:

> **Primary Equation**: $Q = U \cdot A \cdot \Delta T_{lm}$  
> **Engineering Impact**: Sizing validation for pasteurization and cooling tunnels.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| U | Heat Transfer Coeff | Engineering Constant |
| A | Area | ** cm²** |
| \Delta T_{lm} | LMTD | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal cycling stress (ΔT=60°C, 1000 cycles) | 8 | Solder joint fatigue cracking at LED driver attachment points | Copper-core solder joints with 0.3mm standoff height and corner fillets |
| Aluminum fin corrosion in chloride environments (&gt;500ppm Cl⁻) | 8 | Fin efficiency reduction from 85% to &lt;40% due to oxide layer buildup | Anodized aluminum fins with 25μm coating thickness and hydrophobic surface treatment |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| surface_area | Config-dependent | cm² | Verified |
| thermal_resistance | Config-dependent | °C/W | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **CNC Machining Center**, **Anodizing Line**, **Thermal Testing Chamber**  
**Downstream Applications**: LED Street Lights, LED High Bay Lights, LED Flood Lights  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What makes this heat sink suitable for LED lighting applications?
**A**: This precision heat sink is specifically designed for LED lighting systems, using Aluminum Alloy 6063 with anodized coating to efficiently dissipate heat from electronic drivers, extending LED lifespan and maintaining optimal performance.

### Q: How does the thermal interface material improve heat dissipation?
**A**: The thermal interface pad creates optimal contact between the heat sink and electronic components, minimizing thermal resistance and ensuring maximum heat transfer from LED drivers to the cooling fins for effective thermal management.

### Q: What are the key specifications to consider when selecting this heat sink?
**A**: Key specifications include base plate thickness, fin height and pitch, surface finish (Ra value), thermal resistance (°C/W), and weight. These determine the heat sink's cooling capacity and compatibility with your LED lighting system design.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- ANSI/ASME Y14.5-2018 - DIMENSIONING AND TOLERANCING
- DIN EN 1676:1997 - ALUMINIUM AND ALUMINIUM ALLOYS - EXTRUDED ROD/BAR, TUBE AND PROFILES

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Precision Heat Sink Assembly](https://cnfx.com/industry/manufacture-lighting-equipment/product/precision-heat-sink-assembly)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PRECISION_HEAT_SINK_ASSEMBLY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 4b4fe78b
