Manufacturer AUTHENTICATED
Wire Bonding Machine
Documented Capability Profile
URN
URN:CNFX:NODE:jiangsu-himalaya-semiconductor-co-ltd:wire-bonding-machine
Manufacturer
Jiangsu Himalaya Semiconductor Co., Ltd.
Asset Specifications
"A precision machine that creates electrical interconnections between semiconductor chips and their packages using fine wires."
Global Location
Suzhou, CN
Fulfillment Cycle
Est. 15 Days
On-Chain Metadata
Trade MOA
1 Unit(s)
Verification Hash
NODE-7EAAB548EB7DF5A75279B74DB83E3715
PROTOCOL V5.2 SECURED