Manufacturer AUTHENTICATED
Wire Bonder
Documented Capability Profile
URN
URN:CNFX:NODE:shenzhen-akusense-technology-co-ltd:wire-bonder
Manufacturer
Shenzhen Akusense Technology Co., Ltd.
Asset Specifications
"A precision machine used in semiconductor packaging to create electrical connections between integrated circuits and their packages using fine wires."
Global Location
Chengdu, CN
Fulfillment Cycle
Est. 15 Days
On-Chain Metadata
Trade MOA
1 Unit(s)
Verification Hash
NODE-895E9E157293A38CD2930C85E04A8BB5
PROTOCOL V5.2 SECURED