Manufacturer AUTHENTICATED
Wire Bonding Machine
Documented Capability Profile
URN
URN:CNFX:NODE:toolguangdong-tenghong-machinery-technology-co-ltd:wire-bonding-machine
Manufacturer
toolGuangdong Tenghong Machinery Technology Co., Ltd.
Asset Specifications
"A precision machine that creates electrical interconnections between semiconductor chips and their packages using fine wires."
Global Location
Dongguan, CN
Fulfillment Cycle
Est. 15 Days
On-Chain Metadata
Trade MOA
1 Unit(s)
Verification Hash
NODE-925539EDF73C12230BEE9DC654C33354
PROTOCOL V5.2 SECURED