INDUSTRY COMPONENT

Infrared Detector Element

Infrared detector element converts infrared radiation into electrical signals for temperature measurement and motion detection.

Component Specifications

Definition
An infrared detector element is a semiconductor-based electronic component that detects infrared radiation within specific wavelength ranges (typically 0.7-14 μm). It operates by converting incident infrared photons into measurable electrical signals through photoelectric or thermal effects, enabling non-contact temperature measurement, motion sensing, and thermal imaging applications in industrial automation.
Working Principle
The element functions through either photonic detection (using materials like InGaAs, HgCdTe, or pyroelectric crystals that generate electrical charge when exposed to IR radiation) or thermal detection (using thermopiles or microbolometers that change resistance with temperature). Incident IR radiation causes electron excitation in semiconductor materials, producing voltage or current proportional to radiation intensity, which is then amplified and processed by associated circuitry.
Materials
Semiconductor materials: InGaAs (0.7-2.6 μm), HgCdTe/MCT (3-5 μm, 8-14 μm), InSb (3-5 μm), pyroelectric materials (LiTaO₃, PZT), silicon microbolometers; Packaging: TO-5, TO-8, or ceramic packages with germanium/silicon windows; Electrodes: Gold bonding wires.
Technical Parameters
ParameterTypical rangeNotes & selection driver
Responsivity1-10 V/W
Field Of View20°-120°
Response Time1 ns-1 ms
Spectral Range0.7-14 μm
Detectivity (D*)10^8-10^11 cm·Hz¹/²/W
Operating Temperature-40°C to +85°C
Noise Equivalent Power10^-9-10^-12 W/Hz¹/²

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards
ISO 18434-1, IEC 62471, ASTM E1256

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Thermal drift affecting accuracy
  • Window contamination reducing sensitivity
  • Electrostatic discharge damage
  • Moisture ingress causing failure
FMEA Triads
Trigger: Thermal stress from rapid temperature changes
Failure: Cracking of semiconductor material or packaging
Mitigation: Implement gradual temperature cycling in operation, use thermal interface materials, and design with expansion-matched materials
Trigger: Electrostatic discharge during handling
Failure: Permanent damage to sensitive semiconductor junctions
Mitigation: Use ESD-protected workstations, proper grounding, and antistatic packaging during manufacturing and installation

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance
±2% of reading or ±2°C for temperature measurement applications
Test Method
Calibration against blackbody radiation sources per ASTM E1256, spectral response testing using monochromators, and environmental testing per IEC 60068-2 standards

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Infrared Detector Element

Manufacturer profiles associated with Infrared Detector Element.

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Frequently Asked Questions

What is the difference between photonic and thermal infrared detectors?

Photonic detectors (like InGaAs or HgCdTe) directly convert photons to electrons, offering faster response and higher sensitivity but require cooling. Thermal detectors (like pyroelectric or microbolometer) measure temperature changes, operating at room temperature with slower response but broader spectral range.

How do I select the right infrared detector element for my application?

Consider spectral range (match target emission wavelength), response time (faster for motion detection), sensitivity (D* value), operating temperature, and environmental conditions. For high-speed applications, choose photonic detectors; for cost-effective thermal imaging, select microbolometers.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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