Microvia: Diameter 50-150 μm, Plating Thickness 15-25 μm

Component Specifications

Definition

A microvia is a type of via with a diameter typically less than 150 microns, created using laser drilling technology in High-Density Interconnect (HDI) printed circuit boards. It enables vertical electrical connections between adjacent layers in multilayer PCBs, allowing for higher component density, reduced signal path lengths, and improved electrical performance in compact electronic devices.

Working Principle

Microvias work by creating conductive pathways between PCB layers through laser ablation of dielectric material, followed by metallization (usually copper plating) to establish electrical continuity. They use sequential build-up technology where layers are added and interconnected progressively, unlike traditional through-hole vias that penetrate the entire board thickness.

Materials

Dielectric materials: FR-4, polyimide, BT epoxy, or specialized HDI laminates. Conductive material: Electroless copper plating followed by electrolytic copper plating. Surface finish: ENIG (Electroless Nickel Immersion Gold), immersion silver, or OSP (Organic Solderability Preservative).

Technical Parameters

Parameter	Typical range	Notes & selection driver
Diameter	50-150 μm
Layer Count	Up to 20+ layers
Aspect Ratio	0.75:1 to 1:1
Drilling Method	UV or CO2 laser
Plating Thickness	15-25 μm
Registration Accuracy	±15 μm

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IPC-6012, IPC-2226, J-STD-001, ISO 9001

Parent Products

This component is used in the following industrial products

HDI PCB

A printed circuit board with high wiring density per unit area, featuring microvias, fine lines, and multiple sequential lamination layers.

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Engineering Analysis

Risks & Mitigation

Thermal stress cracking
Plating voids
Registration inaccuracies
Signal integrity issues
Manufacturing yield variations

FMEA Triads

Trigger: Insufficient copper plating
Failure: Open circuit or high resistance
Mitigation: Optimize plating parameters and implement automated optical inspection

Trigger: Thermal expansion mismatch
Failure: Barrel cracking during thermal cycling
Mitigation: Use compatible materials with matched CTE and implement thermal stress testing

Trigger: Laser drilling misalignment
Failure: Poor interconnection or short circuits
Mitigation: Implement precision registration systems and statistical process control

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±15 μm positional accuracy, ±10 μm diameter tolerance

Test Method

Cross-section analysis, electrical continuity testing, thermal cycling (IPC-TM-650), microsection evaluation

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Microvia

Manufacturer profiles associated with Microvia.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the difference between microvia and through-hole via?

Microvias are laser-drilled and connect only adjacent layers with diameters under 150μm, while through-hole vias are mechanically drilled through the entire board with larger diameters and connect all layers.

What are the advantages of using microvias?

Microvias enable higher component density, shorter signal paths, better electrical performance, reduced layer count, and smaller form factors in electronic devices.

What are the common failure modes of microvias?

Common failures include plating voids, cracks due to thermal stress, registration errors, and copper barrel fractures during thermal cycling.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Microvia