RF substrate is a specialized printed circuit board material designed for high-frequency signal transmission in radio frequency applications.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Copper Thickness | 0.5-2 oz | |
| Moisture Absorption | <0.02% | |
| Thickness Tolerance | ±0.05 mm | |
| Thermal Conductivity | 0.2-1.5 W/mK | |
| Operating Temperature | -55°C to +150°C | |
| Dissipation Factor (Df) | <0.005 | |
| Dielectric Constant (Dk) | 2.2-10.5 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
Manufacturer profiles associated with RF Substrate.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
RF substrates have lower dielectric constant and dissipation factor than FR-4, reducing signal loss at high frequencies. They offer better impedance control and thermal stability for microwave applications.
Lower dielectric constant (Dk) reduces signal propagation delay and capacitive coupling, enabling higher frequency operation with minimal signal distortion and improved phase stability.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.