This page explains how Hash Computation Core is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
The central processing unit within a hash generator that performs cryptographic hash computations.
Technical details and manufacturing context for Hash Computation Core
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Hash Rate | 10–100 GH/s | Throughput for SHA-256 |
| Power Consumption | 50–500 W | Depends on hash rate and efficiency |
| Supply Voltage | 12 ±5% V DC | Input voltage range |
| Operating Temperature | -40–85 °C | Ambient temperature range |
| Storage Temperature | -55–125 °C | Non-operating range |
| Relative Humidity | 5–95 % | Non-condensing |
| Ingress Protection | IP40–IP65 | Depends on enclosureIEC 60529 |
| Clock Frequency | 100–500 MHz | Core clock speed |
| Process Node | 7–28 nm | Semiconductor technology |
| Package Type | BGA-256–BGA-1156 | Ball grid arrayJEDEC |
| Weight | 5–50 g | Component weight |
| Dimensions | 15×15–45×45 mm | Package footprint |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | N/A (solid-state component) |
| other spec: | Power Supply: 0.8V to 1.2V DC, Clock Frequency: Up to 500 MHz |
| temperature: | -40°C to +85°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
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It is the central processing unit within a hash generator that performs cryptographic hash computations, implementing algorithms like SHA-256 or MD5 to produce fixed-length hash values.
Reference ranges include hash rate 10-100 GH/s for SHA-256, power consumption 50-500 W, supply voltage 12V DC ±5%, operating temperature -40 to 85°C, and process node 7-28 nm. Confirm exact values with the manufacturer.
It is made on silicon wafers with copper interconnects and dielectric materials. Package types range from BGA-256 to BGA-1156, with dimensions 15×15 to 45×45 mm and weight 5-50 g.
Check the ingress protection rating (IP40-IP65 per IEC 60529) and other standards with the legal manufacturer or supplier. Ensure the component meets your application's environmental and electrical requirements.
This component is essential for the following industrial systems and equipment:
Commonly used trade names and technical identifiers for Hash Computation Core.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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