Metal Core Substrate: Copper Thickness 35-140 μm

Component Specifications

Definition

A Metal Core Substrate (MCS) is a type of printed circuit board (PCB) that incorporates a metal core, typically aluminum or copper, as its base material. This metal layer provides superior thermal conductivity compared to traditional FR4 substrates, allowing for efficient heat dissipation from power components like LEDs, power transistors, and motor drivers. The structure typically consists of a dielectric layer (e.g., thermally conductive epoxy) laminated between the metal core and the copper circuit layer, ensuring electrical insulation while facilitating heat transfer. MCS is critical in applications requiring high reliability and thermal stability, such as automotive electronics, industrial controls, and high-brightness LED lighting systems.

Working Principle

The working principle of a Metal Core Substrate relies on its metal core's high thermal conductivity to transfer heat away from heat-generating electronic components. Heat generated by components mounted on the copper circuit layer conducts through the dielectric layer into the metal core, which then dissipates it into the environment via convection or through attached heat sinks. This prevents overheating, maintains component performance, and extends lifespan by reducing thermal stress.

Materials

Core: Aluminum (e.g., 5052, 6061 alloys) or Copper (C1100); Dielectric Layer: Thermally conductive epoxy or ceramic-filled polymer (thermal conductivity 1-3 W/mK); Circuit Layer: Copper foil (typically 1-4 oz thickness); Surface Finish: HASL, ENIG, or OSP for solderability and corrosion resistance.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Copper Thickness	35-140 μm
Flammability Rating	UL94 V-0
Dielectric Thickness	50-150 μm
Metal Core Thickness	0.8-3.0 mm
Thermal Conductivity	1-3 W/mK
Operating Temperature	-40°C to 150°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 9001, IPC-6012, JIS C 5012

Parent Products

This component is used in the following industrial products

Metal Core PCB

A printed circuit board with a metal core substrate for enhanced thermal management.

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Engineering Analysis

Risks & Mitigation

Thermal expansion mismatch causing delamination
Electrical short circuits if dielectric layer fails
Corrosion of metal core in humid environments
High manufacturing cost compared to FR4 PCBs

FMEA Triads

Trigger: Poor dielectric layer adhesion
Failure: Delamination between metal core and circuit layer
Mitigation: Use high-quality laminates and strict process controls during manufacturing

Trigger: Excessive thermal cycling
Failure: Cracking in solder joints or components
Mitigation: Design with thermal vias and adequate heat sinking; select components rated for temperature ranges

Trigger: Moisture ingress
Failure: Corrosion of metal core or electrical leakage
Mitigation: Apply conformal coating and ensure proper sealing in end-use applications

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1 mm for core thickness, ±10% for dielectric thickness

Test Method

Thermal conductivity testing per ASTM D5470, electrical insulation testing per IPC-TM-650, and thermal cycling per JEDEC JESD22-A104

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Metal Core Substrate

Manufacturer profiles associated with Metal Core Substrate.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What are the main advantages of Metal Core Substrates over standard PCBs?

Metal Core Substrates offer superior thermal management, higher power handling, improved reliability in high-temperature environments, and longer component lifespan due to reduced thermal stress.

In which industries are Metal Core Substrates commonly used?

They are widely used in automotive electronics (e.g., headlights, power converters), industrial equipment (motor drives, power supplies), LED lighting, and renewable energy systems (solar inverters).

Can Metal Core Substrates be used for high-frequency applications?

Yes, but with limitations; the metal core can cause electromagnetic interference, so careful design (e.g., grounding, shielding) is required for RF or high-speed circuits.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Metal Core Substrate