This page explains how Metal Core PCB is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board with a metal core substrate for enhanced thermal management.
Technical details and manufacturing context for Metal Core PCB
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Dielectric Thermal ConductivityRequired | 1.0–2.0 W/m·K | Thermal conductivity of the insulating layer between circuit and metal coreIPC-4101 |
| Metal Core ThicknessRequired | 0.8–3.2 mm | Thickness of the metal substrate layerIPC-6012 |
| Copper WeightRequired | 1–4 oz/ft² | Thickness of copper foil on circuit layersIPC-6012 |
| Dielectric ThicknessRequired | 50–150 mm | Thickness of the thermally conductive insulating layerIPC-4101 |
| Maximum Operating TemperatureRequired | 130–150 °C | Highest temperature the PCB can withstand during operationIPC-4101 |
| Thermal ResistanceRequired | 0.5–2.0 °C/W | Resistance to heat flow from component to heat sinkIPC-9691 |
| Board Thickness | 1.0–3.2 mm | Total thickness including core, dielectric, and copper.IPC-6012 |
| Minimum Trace Width/Spacing | 0.1–0.2 mm | Finer geometries enable higher circuit density.IPC-2221 |
| Peel Strength | 0.8–1.2 N/mm | Ensures copper foil adhesion to dielectric under thermal stress.IPC-TM-650 2.4.8 |
| Flammability Rating | 94V-0 | Required for safety in consumer electronics.UL 94 |
| Surface Finish | HASL, ENIG, OSP | ENIG offers better flatness and corrosion resistance.IPC-4552 |
| Maximum Board Size | 600×600 mm | Limited by manufacturing equipment and handling. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Metal Core PCB.
| pressure: | Atmospheric to 5 bar (typical), up to 10 bar (with reinforced design) |
| other spec: | Thermal conductivity: 1-8 W/m·K (depending on metal core material), dielectric strength: >3 kV/mm |
| temperature: | -40°C to +150°C (operating), up to +300°C (peak transient) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The metal core acts as a heat sink, efficiently conducting heat away from electronic components to prevent overheating and maintain reliable operation.
Aluminum and copper are typical metal core materials, chosen for their high thermal conductivity.
Relevant standards include IPC-4101 for dielectric materials, IPC-6012 for board fabrication, IPC-9691 for thermal resistance, and UL 94 for flammability. Always verify compliance with the manufacturer.
The dielectric layer must be thermally conductive to transfer heat to the metal core while electrically insulating the circuit. Its thermal conductivity and thickness are key parameters.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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