Automated optical inspection (AOI) system for PCB assembly

01

Identify the measurement method and visible defect features

NeoDen’s ND800 page describes a colour-camera in-line AOI with an optional telecentric lens. It lists missing, offset, reversed or wrong components and visible solder defects among its inspection items. These are stated inspection capabilities, not a measured detection/false-call result for every board. [1]

The dated Omron VT-S730/730H brochure combines planar images, DLP phase-shift projection, Color Highlight and side-camera views. It also discusses limitations from shadowing and reflective surfaces. A 3D label does not eliminate occlusion; ask which view and measurement detects each required defect. [2]

02

Separate camera sampling, positioning and measurement range

The ND800 page lists a 5-megapixel camera, with 16/20-megapixel options, separately from XY positioning accuracy of ≤8 µm. Pixel count and motion positioning accuracy are different quantities; neither alone states the minimum detectable solder defect. [1]

The Omron brochure, issue October 2017, specifies 15 µm planar, 10 µm oblique and 1 µm height resolution, with height measurement up to 25 mm. Its separate 40 mm component clearance above and below the board is a physical clearance specification, not the measurable height range. [2]

The Saki announcement reproduced in EPP Europe on 30 May 2022 gives an exhibited 3Di configuration with 8 µm camera resolution, a 25 mm height-measurement range and 4,500 mm²/s imaging speed. Keep these with the dated announced configuration, rather than assigning them to every current 3Di machine. [3]

03

Keep ideal area-rate arithmetic separate from inspection cycle

Viscom’s iS6059 PCB Inspection Plus page lists a 50 × 50 mm field of view, inspection speed up to 80 cm²/s and board dimensions of 508 × 508 mm. These are distinct specification fields; board transfer, selected views, processing and verification affect the commissioned cycle. [4]

Editorial calculation: assuming the entire 508 × 508 mm rectangle is covered once at a constant 80 cm²/s, its 258,064 mm² divided by 8,000 mm²/s is approximately 32.3 s of ideal area coverage. This excludes transfer, motion/settling, overlap, extra views, image processing and re-inspection. It is neither manufacturer-published cycle time nor measured inspection data. [4]

A field-of-view area division does not establish the machine’s actual image-position count or scanning strategy. Obtain a timed run of the inspection recipe on the required board, including the required defect coverage. [4]

04

Match the assembled-board machine to the intended process

The reviewed NeoDen product is an assembled-board in-line AOI. Bare-board inner/outer-layer inspection, solder-paste inspection and assembled-board optical inspection serve different process boundaries, even when an equipment or PCB-services website uses the same AOI abbreviation. [1]

Identify pre- or post-reflow position, visible defect list and sample-board evidence. The supplier should state its delivered machine, programming/verification software and line integration for that inspection task. [2]

05

Connect optics and motion to the inspection result

The cited machine information separates cameras and lens options, illumination/projection, board handling and inspection software. Omron’s brochure distinguishes image acquisition from offline programming and debugging; a short programming capture does not state production inspection cycle time. [1] [2]

Viscom describes inspection views, height measurement, traceability and verification software. Confirm the selected optical configuration and software functions as delivered; a software or camera-family name alone does not establish board-level defect performance. [4]

06

Validate board capacity, defect coverage and takt together

For the ND800, the listed board range is 50 × 50 to 400 × 360 mm with thickness 0.3–5 mm. The page’s maximum 830 mm/s moving/transfer speed is not area inspection speed or boards per hour. [1]

Give the supplier the board dimensions, thickness, warpage, component heights and known-defect samples, plus the intended line position and traceability interface. Obtain measured cycle time, missed-defect and false-call evidence for the agreed recipe. Keep resolution, physical clearance and defect acceptance as separate fields. [2] [4]

07

Send the board, component and line data together

Paste it into your enquiry below or into an email to a maker, then replace every bracket.

Boards: [size; thickness; weight; samples with defects]
Components: [smallest; tallest; fine pitch]
Position: [pre- or post-reflow]
Mode: [2D; 3D height]
Resolution: [µm per pixel; height range]
Speed: [takt time; imaging speed]
Defects: [list to detect; false-call target]
Data: [SMEMA; MES; traceability]

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