Electrical isolation component in crosspoint switches preventing signal interference between channels.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Surface Roughness | < 0.1 μm Ra | |
| Dielectric Constant | 3.0-4.0 @ 1 MHz | |
| Dielectric Strength | > 500 V/μm | |
| Thickness Tolerance | ±5% | |
| Thermal Conductivity | 1.0-30 W/m·K | |
| Operating Temperature | -55°C to +150°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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The isolation layer prevents signal interference between adjacent channels by creating electrical and electromagnetic barriers, ensuring clean signal routing without crosstalk or leakage.
Thicker layers provide better isolation but increase parasitic capacitance; optimal thickness balances isolation effectiveness with signal propagation speed and switch density requirements.
Typically no - isolation layers are integrated during semiconductor fabrication or assembly; damage usually requires complete component replacement due to precision manufacturing requirements.
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