A precision mounting plate used in probe card interfaces for semiconductor wafer testing.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Flatness | ≤ 0.025 mm over entire surface | |
| Thickness | 10-25 mm (depending on application) | |
| Parallelism | ≤ 0.015 mm | |
| Surface Hardness | ≥ 80 HRB for aluminum, ≥ 25 HRC for steel | |
| Mounting Hole Tolerance | H7 | |
| Thermal Expansion Coefficient | Matched to probe card materials |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Mechanical Mounting Plate.
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The primary function is to provide precise, stable, and repeatable mounting for probe cards, ensuring accurate alignment with wafer test equipment and maintaining electrical contact integrity during semiconductor testing.
Material selection affects thermal stability, mechanical rigidity, weight, and compatibility with probe card materials. Proper material matching minimizes thermal expansion mismatches that could cause alignment errors during temperature cycling.
Inspect every 50,000 test cycles or quarterly, whichever comes first. Check for flatness degradation, mounting hole wear, and surface damage that could affect probe card alignment.
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