A high-density integrated circuit assembly of memory chips arranged in a matrix configuration for data storage in electronic systems.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Voltage | 1.2V to 3.3V | |
| Capacity | 4GB to 256GB per array | |
| Data Rate | Up to 6400 MT/s | |
| Interface | DDR4, DDR5, LPDDR4, LPDDR5 | |
| Form Factor | DIMM, SODIMM, BGA | |
| Error Correction | ECC support | |
| Operating Temperature | -40°C to 85°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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Manufacturer profiles associated with Memory Chip Array.
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The primary function is to provide high-density, reliable data storage with fast access times for computing and industrial systems.
An array combines multiple chips into a unified structure, offering higher capacity, parallel data access, and improved performance through redundancy and interleaving.
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