INDUSTRY COMPONENT

Package/Lens

Integrated lens and housing component for infrared emitters that protects the semiconductor die while controlling light emission patterns.

Component Specifications

Definition
A hermetic or non-hermetic optical package containing an infrared LED or laser diode chip, wire bonds, and a precision-molded lens that shapes the emitted infrared radiation beam. The package provides mechanical protection, thermal management, electrical connections, and optical control for the emitter.
Working Principle
The package encapsulates the semiconductor die in a protective housing while the integrated lens (typically molded from optical-grade plastic or glass) collimates, focuses, or diffuses the emitted infrared light through refraction and total internal reflection principles. The lens geometry determines the emission angle, intensity distribution, and optical efficiency.
Materials
Lens: Optical-grade polycarbonate, PMMA, or glass with IR-transmissive coatings. Housing: Thermoplastic (PBT, PCT) or ceramic (Al2O3) with metal leadframes (Alloy 42, copper). Seal: Epoxy resin or glass frit for hermetic packages. Die attach: Silver epoxy or solder.
Technical Parameters
  • Wavelength 850-940 nm
  • Viewing Angle 15-120 degrees
  • Forward Current 20-100 mA
  • Power Dissipation 75-150 mW
  • Radiant Intensity 10-100 mW/sr
  • Package Dimensions 3-10 mm diameter
  • Operating Temperature -40°C to +85°C
Standards
ISO 10110, IEC 60747-5-5, JEDEC MSL

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package/Lens.

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Delamination under thermal cycling
  • Lens yellowing from UV exposure
  • Moisture ingress in non-hermetic packages
  • Misalignment during assembly affecting beam pattern
FMEA Triads
Trigger: Thermal expansion mismatch between lens and housing materials
Failure: Cracked lens or broken wire bonds
Mitigation: Use materials with matched CTE, implement stress-relief designs, and control curing processes
Trigger: Inadequate mold release during lens fabrication
Failure: Surface defects scattering light
Mitigation: Apply anti-stick coatings, maintain mold temperature, and implement optical inspection

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Lens focal length ±2%, beam angle ±5%, dimensional ±0.1 mm
Test Method
IEC 60747-5-5 for optoelectronic devices, MIL-STD-883 for environmental stress, and radiometric testing with integrating spheres

Buyer Feedback

★★★★☆ 4.8 / 5.0 (26 reviews)

"The Package/Lens we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."

"Found 34+ suppliers for Package/Lens on CNFX, but this spec remains the most cost-effective."

"The technical documentation for this Package/Lens is very thorough, especially regarding technical reliability."

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Frequently Asked Questions

What is the difference between hermetic and non-hermetic packages for IR emitters?

Hermetic packages use glass or ceramic seals to prevent moisture and gas ingress, ensuring long-term reliability in harsh environments. Non-hermetic packages use epoxy resins and are cost-effective for commercial applications with controlled conditions.

How does lens geometry affect IR emitter performance?

Lens curvature and surface finish determine the emission pattern: spherical lenses provide wide angles, aspheric lenses collimate beams for longer distances, and diffuser lenses create uniform illumination. Precise molding ensures consistent optical characteristics.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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