Integrated lens and housing component for infrared emitters that protects the semiconductor die while controlling light emission patterns.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Wavelength | 850-940 nm | |
| Viewing Angle | 15-120 degrees | |
| Forward Current | 20-100 mA | |
| Power Dissipation | 75-150 mW | |
| Radiant Intensity | 10-100 mW/sr | |
| Package Dimensions | 3-10 mm diameter | |
| Operating Temperature | -40°C to +85°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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Manufacturer profiles associated with Package/Lens.
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Hermetic packages use glass or ceramic seals to prevent moisture and gas ingress, ensuring long-term reliability in harsh environments. Non-hermetic packages use epoxy resins and are cost-effective for commercial applications with controlled conditions.
Lens curvature and surface finish determine the emission pattern: spherical lenses provide wide angles, aspheric lenses collimate beams for longer distances, and diffuser lenses create uniform illumination. Precise molding ensures consistent optical characteristics.
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