Packaging/Casing: Frequency Range 10 MHz to 10 GHz

Component Specifications

Definition

A specialized enclosure designed to protect bandpass and surface acoustic wave (SAW) filters from environmental factors, electromagnetic interference, and physical damage while maintaining precise electrical performance and thermal management

Working Principle

Provides mechanical protection, electromagnetic shielding, thermal dissipation, and environmental sealing to maintain filter stability and performance by isolating sensitive components from external disturbances

Materials

Aluminum alloys (6061, 5052), Kovar (Fe-Ni-Co alloy), ceramic (Al2O3, AlN), plastic (PPS, LCP) with metal plating, stainless steel (304, 316)

Technical Parameters

Parameter	Typical range	Notes & selection driver
IP Rating	IP67/IP68 for sealed versions
Dimensions	3mm x 3mm to 50mm x 50mm
Return Loss	>15 dB
Insertion Loss	<0.5 dB
Frequency Range	10 MHz to 10 GHz
Thermal Resistance	<10°C/W
Operating Temperature	-40°C to +125°C
Shielding Effectiveness	>40 dB at 1-10 GHz

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IEC 60191, MIL-STD-883, JEDEC MSL, RoHS, REACH

Parent Products

This component is used in the following industrial products

Filter (Bandpass/SAW)

An electronic component that selectively passes signals within a specific frequency range while attenuating others, used in receiver circuits.

View Product Details

Engineering Analysis

Risks & Mitigation

EMI leakage
thermal overheating
mechanical stress on piezoelectric elements
moisture ingress
resonance coupling
solder joint failure
CTE mismatch

FMEA Triads

Trigger: Inadequate EMI shielding design
Failure: Electromagnetic interference affecting adjacent circuits
Mitigation: Implement multi-layer shielding, proper grounding, and conductive gaskets

Trigger: Thermal expansion coefficient mismatch
Failure: Cracking of ceramic substrates or solder joints
Mitigation: Use matched CTE materials, compliant interconnects, and stress-relief designs

Trigger: Insufficient environmental sealing
Failure: Moisture ingress causing corrosion and performance degradation
Mitigation: Apply hermetic sealing, conformal coatings, and proper gasket materials

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1mm dimensional tolerance, ±0.05mm flatness, Ra 0.8μm surface finish

Test Method

Vibration testing (MIL-STD-810), thermal cycling (JESD22-A104), hermeticity testing (MIL-STD-883 Method 1014), EMI testing (CISPR 32), salt spray testing (ASTM B117)

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

Compare the published product scope and source details, then include your specifications and quantity in an enquiry.

Manufacturers of Packaging/Casing

Manufacturer profiles associated with Packaging/Casing.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What are the key considerations when selecting packaging for SAW filters?

Key considerations include electromagnetic compatibility (EMC) requirements, thermal management needs, environmental sealing (moisture/dust resistance), mechanical robustness, size constraints, and compatibility with automated assembly processes.

How does packaging affect filter performance?

Packaging affects insertion loss, return loss, frequency stability, power handling capability, and temperature performance through factors like material dielectric properties, shielding effectiveness, thermal conductivity, and mechanical stress on piezoelectric substrates.

What materials are best for high-frequency filter packaging?

For high-frequency applications (>1 GHz), low-loss materials like ceramic (Al2O3, AlN) or specialized plastics (LCP) with excellent dimensional stability and low dielectric constant are preferred to minimize parasitic effects.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Packaging/Casing