INDUSTRY COMPONENT

Packaging/Casing

Protective housing for bandpass and SAW filters in electronic devices

View Specifications

Component Specifications

Definition
A specialized enclosure designed to protect bandpass and surface acoustic wave (SAW) filters from environmental factors, electromagnetic interference, and physical damage while maintaining precise electrical performance and thermal management
Working Principle
Provides mechanical protection, electromagnetic shielding, thermal dissipation, and environmental sealing to maintain filter stability and performance by isolating sensitive components from external disturbances
Materials
Aluminum alloys (6061, 5052), Kovar (Fe-Ni-Co alloy), ceramic (Al2O3, AlN), plastic (PPS, LCP) with metal plating, stainless steel (304, 316)
Technical Parameters
  • IP Rating IP67/IP68 for sealed versions
  • Dimensions 3mm x 3mm to 50mm x 50mm
  • Return Loss >15 dB
  • Insertion Loss <0.5 dB
  • Frequency Range 10 MHz to 10 GHz
  • Thermal Resistance <10°C/W
  • Operating Temperature -40°C to +125°C
  • Shielding Effectiveness >40 dB at 1-10 GHz
Standards
ISO 9001, IEC 60191, MIL-STD-883, JEDEC MSL, RoHS, REACH

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Packaging/Casing.

filter packaging SAW filter casing bandpass filter enclosure electronic component housing EMI shielding RF packaging surface acoustic wave filter microwave component packaging Packaging/Casing Packaging/Casing in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Filter (Bandpass/SAW)

An electronic component that selectively passes signals within a specific frequency range while attenuating others, used in receiver circuits.

View Product Details

Engineering Analysis

Risks & Mitigation
  • EMI leakage
  • thermal overheating
  • mechanical stress on piezoelectric elements
  • moisture ingress
  • resonance coupling
  • solder joint failure
  • CTE mismatch
FMEA Triads
Trigger: Inadequate EMI shielding design
Failure: Electromagnetic interference affecting adjacent circuits
Mitigation: Implement multi-layer shielding, proper grounding, and conductive gaskets
Trigger: Thermal expansion coefficient mismatch
Failure: Cracking of ceramic substrates or solder joints
Mitigation: Use matched CTE materials, compliant interconnects, and stress-relief designs
Trigger: Insufficient environmental sealing
Failure: Moisture ingress causing corrosion and performance degradation
Mitigation: Apply hermetic sealing, conformal coatings, and proper gasket materials

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.1mm dimensional tolerance, ±0.05mm flatness, Ra 0.8μm surface finish
Test Method
Vibration testing (MIL-STD-810), thermal cycling (JESD22-A104), hermeticity testing (MIL-STD-883 Method 1014), EMI testing (CISPR 32), salt spray testing (ASTM B117)

Buyer Feedback

★★★★☆ 4.9 / 5.0 (22 reviews)

"The technical documentation for this Packaging/Casing is very thorough, especially regarding technical reliability."

"Reliable performance in harsh Computer, Electronic and Optical Product Manufacturing environments. No issues with the Packaging/Casing so far."

"Testing the Packaging/Casing now; the technical reliability results are within 1% of the laboratory datasheet."

Related Components

Memory Module
Memory module for Industrial IoT Gateway data storage and processing
Storage Module
Industrial-grade storage module for data logging and firmware in IoT gateways
Ethernet Controller
Industrial Ethernet controller for real-time data transmission in Industrial IoT Gateways.
Serial Interface
Serial interface for industrial data transmission between IoT gateways and legacy equipment using RS-232/422/485 protocols.

Frequently Asked Questions

What are the key considerations when selecting packaging for SAW filters?

Key considerations include electromagnetic compatibility (EMC) requirements, thermal management needs, environmental sealing (moisture/dust resistance), mechanical robustness, size constraints, and compatibility with automated assembly processes.

How does packaging affect filter performance?

Packaging affects insertion loss, return loss, frequency stability, power handling capability, and temperature performance through factors like material dielectric properties, shielding effectiveness, thermal conductivity, and mechanical stress on piezoelectric substrates.

What materials are best for high-frequency filter packaging?

For high-frequency applications (>1 GHz), low-loss materials like ceramic (Al2O3, AlN) or specialized plastics (LCP) with excellent dimensional stability and low dielectric constant are preferred to minimize parasitic effects.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Get Quote for Packaging/Casing

Packaging Packaging/Window