Shielding Cans: Component Specs, Materials & Applications

Component Specifications

Definition

Shielding cans are precision-engineered metal enclosures designed to isolate and protect sensitive radio frequency (RF) circuitry on printed circuit boards (PCBs) from electromagnetic interference (EMI) and radio frequency interference (RFI). These components create a Faraday cage effect around critical RF sections, preventing signal degradation, cross-talk, and external noise contamination while containing electromagnetic emissions to comply with regulatory standards.

Working Principle

Shielding cans operate on the principle of electromagnetic shielding through conductive enclosure. When electromagnetic waves encounter the conductive metal surface, induced currents are generated that cancel out the incoming fields through reflection and absorption. The continuous conductive enclosure creates a grounded barrier that prevents both ingress and egress of electromagnetic energy, effectively isolating the protected RF circuitry from external interference and preventing its emissions from affecting adjacent components.

Materials

Typically manufactured from tin-plated steel (SPTE), nickel-silver alloys (CuNiZn), aluminum alloys (5052, 6061), or beryllium copper (BeCu) for spring contacts. Material selection depends on required shielding effectiveness (typically 30-60 dB), mechanical properties, corrosion resistance, and solderability. Thickness ranges from 0.1mm to 0.3mm with surface finishes including tin, nickel, or gold plating for improved conductivity and corrosion resistance.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Height	3-25mm depending on component clearance
Grounding	Multiple solder tabs (4-12 per side)
Dimensions	Custom to PCB layout (typically 5-50mm sides)
Resonant Frequency	Designed above operational RF range
Operating Temperature	-40°C to +125°C
Shielding Effectiveness	40-60 dB @ 1-10 GHz

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IEC 61000-5-7, MIL-STD-461, EN 55032, IPC-2221

Parent Products

This component is used in the following industrial products

Rf Pcb

A specialized printed circuit board designed to operate at radio frequencies for wireless communication applications.

View Product Details

Engineering Analysis

Risks & Mitigation

Inadequate grounding causing reduced shielding effectiveness
Mechanical deformation during assembly affecting fit
Thermal expansion mismatch with PCB
Solder joint fatigue from thermal cycling
Resonant frequencies within operational band

FMEA Triads

Trigger: Poor solder joint integrity at grounding tabs
Failure: Reduced shielding effectiveness leading to EMI/RFI issues
Mitigation: Implement automated optical inspection (AOI) of solder joints, use solder paste with appropriate metallurgy, and design redundant grounding points

Trigger: Mechanical interference with tall components
Failure: Shield deformation or incomplete seating on PCB
Mitigation: Conduct 3D clearance analysis during design, implement component height restrictions in shielded areas, and use stepped shield designs

Trigger: Thermal expansion coefficient mismatch
Failure: Stress on solder joints during temperature cycling
Mitigation: Select materials with compatible CTE, design flexible grounding tabs, and implement stress relief features in shield geometry

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1mm on critical dimensions, flatness within 0.05mm over 25mm span

Test Method

Shielding effectiveness tested per IEC 61000-5-7 using reverberation chamber or GTEM cell methods; visual inspection per IPC-A-610; solderability per J-STD-002

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Shielding Cans

Manufacturer profiles associated with Shielding Cans.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the primary function of shielding cans on RF PCBs?

Shielding cans create isolated electromagnetic environments for RF circuits by preventing both external interference from affecting sensitive components and containing RF emissions to meet regulatory compliance requirements.

How are shielding cans typically grounded to the PCB?

Shielding cans are grounded through multiple solder tabs or spring fingers that make continuous electrical contact with the PCB ground plane around the perimeter of the shielded area, ensuring low-impedance connection for effective shielding.

What materials offer the best shielding effectiveness for RF applications?

Nickel-silver alloys and tin-plated steel provide excellent shielding effectiveness (40-60 dB) for most RF applications, while beryllium copper offers superior performance for spring contacts requiring repeated assembly/disassembly cycles.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Shielding Cans