Thermal sink/housing for heat dissipation and protection in emitter modules
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Weight | 50-500g | |
| Dimensions | Customizable per module requirements | |
| Mounting Type | Screw or clip-based | |
| Surface Finish | Anodized or coated | |
| Thermal Conductivity | 150-400 W/m·K |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
Manufacturer profiles associated with Thermal Sink / Housing.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
To dissipate heat from emitter components and provide protective enclosure.
Aluminum alloys for balance of weight and conductivity, copper for high performance.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.