Interface Plate/Socket for Test Interface Units

Product Specifications

Technical details and manufacturing context for Interface Plate / Socket

Definition

The Interface Plate/Socket is a component used in Test Interface Units (TIUs) within the computer, electronic, and optical product manufacturing industry. It serves as the primary connection interface between the unit under test (UUT) and the testing equipment. The component provides standardized electrical contacts, mechanical alignment, and signal routing capabilities to ensure reliable testing operations. It is designed to mate with corresponding connectors on the UUT, routing test signals from the testing equipment to specific points while maintaining electrical integrity and mechanical stability during the testing process.

Typical materials include copper alloy for contacts, FR-4 substrate for the printed circuit board, and gold plating for contact surfaces. Key parameters, which are reference ranges and must be confirmed for the specific model and application, include: rated current of 5–10 A per contact (IEC 60512), contact resistance ≤20 mΩ initial (IEC 60512-2), insulation resistance ≥1000 MΩ at 500 V DC (IEC 60512-3-1), dielectric withstanding voltage of 500–1500 V AC for 1 minute (IEC 60512-4-1), operating temperature of -40 to 85 °C (IEC 60068-2-1/2), mating cycles of 500–1000 (IEC 60512-9-1), contact pitch of 1.27–2.54 mm, number of contacts from 10 to 200, contact material CuBe with gold plating (ASTM B196), housing material PBT UL94V-0 (UL 94), IP rating of IP54–IP65 (IEC 60529), and weight of 50–500 g. These values are typical ranges; actual specifications depend on the configuration.

Standards listed are for procurement and verification reference only and do not imply certification or compliance of any specific product. Always verify model-specific values and standards with the legal manufacturer or supplier before use.

Working Principle

The Interface Plate/Socket operates by providing precisely aligned electrical contacts that mate with corresponding connectors on the device under test. It routes test signals from the testing equipment to specific points on the unit under test while maintaining electrical integrity and mechanical stability. The contacts are typically made of copper alloy with gold plating to ensure low resistance and corrosion resistance. The FR-4 substrate provides mechanical support and signal routing. During testing, the socket aligns with the UUT, and the contacts establish electrical connections. The design ensures reliable mating over many cycles, with contact resistance remaining stable. The operating principle relies on precise mechanical alignment and electrical contact to ensure accurate signal transmission and measurement.

Common Materials

Copper alloy, FR-4 substrate, Gold plating

Technical Parameters

Parameter	Typical range	Notes & selection driver
Rated Current	5–10 A	Per contact, dependent on contact sizeIEC 60512
Contact Resistance	≤20 mΩ	Initial, before environmental testingIEC 60512-2
Insulation Resistance	≥1000 MΩ	At 500 V DCIEC 60512-3-1
Dielectric Withstanding Voltage	500–1500 V AC	For 1 minute, no breakdownIEC 60512-4-1
Operating Temperature	-40–85 °C	Extended range availableIEC 60068-2-1/2
Mating Cycles	500–1000 cycles	Contact resistance stableIEC 60512-9-1
Contact Pitch	1.27–2.54 mm	Common pitches for test interfaces
Number of Contacts	10–200 pins	Custom configurations available
Contact Material	CuBe, Au plated	Gold plating 0.76 µm minASTM B196
Housing Material	PBT, UL94V-0	Glass-filled for strengthUL 94
IP Rating	IP54–IP65	Dust and water protectionIEC 60529
Weight	50–500 g	Depends on size and contact count

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Contact Pins Part
Provide electrical connection points with spring-loaded or rigid contacts

Material: Copper alloy with gold plating
Insulating Substrate Part
Electrically isolate contacts and provide mechanical support

Material: FR-4 or ceramic
Mounting Frame
Provide structural support and alignment features

Material: Aluminum or steel
Guide Pins Part
Ensure proper alignment during mating with unit under test

Material: Stainless steel

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Interface Plate / Socket.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Test Interface Unit

View system integration details

Manufacturers of Interface Plate / Socket

Manufacturer profiles associated with Interface Plate / Socket.

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Frequently Asked Questions

What is the typical rated current per contact?

The rated current is typically 5–10 A per contact, depending on contact size. This is a reference range; confirm the exact rating for your specific model with the manufacturer.

What materials are commonly used?

Common materials include copper alloy for contacts, FR-4 substrate for the board, and gold plating on contact surfaces. The housing is often made of PBT with UL94V-0 rating. These are typical; verify with the supplier.

What is the operating temperature range?

The operating temperature range is typically -40 to 85 °C, with extended ranges available. This is a reference; check the datasheet for your specific configuration.

How many mating cycles can it withstand?

The component is rated for 500–1000 mating cycles, with contact resistance remaining stable. This is a typical range; actual endurance depends on usage and environment.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	0 to 100 psi (non-pressurized connection)
other spec:	Max current per pin: 5A, Insertion cycles: 10,000+, Contact resistance: <20mΩ
temperature:	-40°C to +125°C

Interface Plate / Socket

Product Specifications

Industry Taxonomies & Aliases

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards