Editorial Technical Reference

Surface Mount Technology (SMT) Pick-and-Place Machine

This page explains how Surface Mount Technology (SMT) Pick-and-Place Machine is classified within Electronic Component Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

Automated machine that precisely places electronic components onto printed circuit boards.

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Product Specifications

Technical details and manufacturing context for Surface Mount Technology (SMT) Pick-and-Place Machine

Definition

A standalone industrial machine used in electronic component manufacturing for automated assembly of printed circuit boards (PCBs). It picks surface-mount devices (SMDs) from feeders and accurately places them onto solder paste applied PCBs according to programmed coordinates. This machine is essential for high-volume, high-precision electronics production, significantly increasing throughput and reducing placement errors compared to manual assembly. It operates as a single unit within a production line but is purchased and configured independently. The machine typically features an aluminum frame, steel guide rails, ceramic nozzles, polycarbonate covers, and copper wiring. Key parameters include placement speed of 15,000–30,000 CPH, placement accuracy of ±0.05 mm at 3 sigma, 80–120 feeder slots, board size up to 510×460 mm, operating pressure of 0.5–0.7 MPa (ISO 8573-1), power supply of 220 V AC ±10%, 50/60 Hz, power consumption of 2.5–4.0 kW, operating temperature of 15–35°C, humidity of 30–70% RH, ingress protection rating of IP20–IP54 (IEC 60529), machine weight of 1200–2500 kg, and footprint of 1500×1500×1600 to 2500×2000×1800 mm. These values are reference ranges; verify model-specific specifications with the legal manufacturer or supplier before procurement.

Working Principle

The machine uses a vision system to identify component position and orientation. A robotic placement head with vacuum nozzles picks components from tape reels or trays and places them onto precise locations on the PCB. The vision system ensures alignment, and the head moves along guide rails to achieve high-speed, accurate placement.

Common Materials

aluminum frame, steel guide rails, ceramic nozzles, polycarbonate covers, copper wiring

Technical Parameters

Parameter	Typical range	Notes & selection driver
Placement SpeedRequired	15,000–30,000 CPH	Maximum components placed per hour
Placement AccuracyRequired	±0.05 mm	Positional accuracy at 3 sigma
Number of FeedersRequired	80–120 slots	Maximum component feeder slots
Board SizeRequired	50×50 – 510×460 mm	Maximum PCB dimensions (LxW)
Operating Pressure	0.5–0.7 MPa	Below 0.5 MPa vacuum may be insufficient.ISO 8573-1
Power Supply	220 V AC ±10%, 50/60 Hz V/Hz	Voltage fluctuation affects servo motor performance.
Power Consumption	2.5–4.0 kW	Higher power for larger machines.
Operating Temperature	15–35 °C	Outside range may affect placement accuracy.
Operating Humidity	30–70 %RH	High humidity can cause solder paste issues.
Ingress Protection Rating	IP20–IP54	Higher IP for dusty environments.IEC 60529
Machine Weight	1200–2500 kg	Heavier machines are more stable.
Footprint (L×W×H)	1500×1500×1600 – 2500×2000×1800 mm	Consider factory floor space.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Placement Head
Component pickup and placement

Material: Aluminum alloy
Vision System
Component and board alignment

Material: Glass lenses, CCD sensors
Component Feeder
Holds and presents SMD components

Material: Plastic, steel springs
XY Motion System
Precise head and board positioning

Material: Steel rails, servo motors
Nozzle Changer Optional
Automatic nozzle exchange for different components

Material: Stainless steel

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Surface Mount Technology (SMT) Pick-and-Place Machine.

Manufacturers of Surface Mount Technology (SMT) Pick-and-Place Machine

Manufacturer profiles associated with Surface Mount Technology (SMT) Pick-and-Place Machine.

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Procurement Evaluation Criteria

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Manufacturing capability

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Frequently Asked Questions

What is the placement speed range?

The placement speed is typically 15,000 to 30,000 components per hour (CPH). This is a reference range; actual speed depends on the specific model and component types.

What is the placement accuracy?

The placement accuracy is ±0.05 mm at 3 sigma. This indicates the positional precision of component placement. Verify the exact accuracy for your intended application with the manufacturer.

What are the power supply requirements?

The machine requires a 220 V AC ±10% power supply at 50/60 Hz. Power consumption ranges from 2.5 to 4.0 kW. Ensure your facility meets these requirements.

What is the operating temperature and humidity range?

The recommended operating temperature is 15–35°C, and relative humidity should be 30–70% RH. Operating outside these ranges may affect placement accuracy and solder paste quality.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	0.5-0.7 MPa (vacuum/pneumatic system)
board size:	50x50 mm to 610x610 mm
temperature:	15-30°C (operating environment)
component range:	0201 metric (0.25x0.125 mm) to 55x55 mm BGA/QFP
placement speed:	10,000-100,000 CPH (components per hour)
placement accuracy:	±0.025-0.05 mm