Array Housing/Frame: IP Rating IP65 minimum, Flatness 0.02 mm/m

Component Specifications

Definition

A precision-engineered mechanical enclosure designed to securely mount and align multiple laser displacement sensors in a coordinated array configuration. It maintains precise geometric relationships between sensors, provides environmental protection against dust, moisture, and mechanical impacts, and manages thermal dissipation to ensure measurement accuracy. The housing typically includes mounting interfaces, cable management systems, and alignment features for industrial automation applications.

Working Principle

The housing maintains fixed spatial relationships between multiple laser displacement sensors through rigid structural design, ensuring consistent measurement planes and reference points. It provides vibration damping, thermal stability through material selection and heat sinking features, and environmental sealing to protect sensitive optical components. Alignment pins, precision machined surfaces, and adjustable mounting points ensure repeatable sensor positioning.

Materials

Aluminum alloy (6061-T6 or 7075-T6) for lightweight rigidity and thermal conductivity, stainless steel (304 or 316) for corrosive environments, or engineered plastics (PEEK, Ultem) for electrical insulation. Surface treatments include anodizing (aluminum), passivation (stainless steel), or powder coating for environmental protection.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Weight	0.5-5 kg depending on size
Flatness	0.02 mm/m
IP Rating	IP65 minimum
Vibration Resistance	5-2000 Hz, 5G
Dimensional Tolerance	±0.05 mm
Mounting Hole Pattern	M4 or M6 threaded
Operating Temperature	-10°C to +60°C
Thermal Expansion Coefficient	23.6 × 10⁻⁶/°C (aluminum)

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 10110-7, ISO 2768-mK, DIN 876, DIN 4768

Parent Products

This component is used in the following industrial products

Sensor Array (e.g., Laser Displacement)

A collection of sensors, such as laser displacement sensors, arranged to measure multiple points or dimensions simultaneously within a vision/sensor system.

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Engineering Analysis

Risks & Mitigation

Misalignment due to thermal expansion
Vibration-induced measurement errors
Environmental seal failure
Galvanic corrosion in mixed-material assemblies
Mounting surface deformation under load

FMEA Triads

Trigger: Thermal cycling in uncontrolled environments
Failure: Dimensional changes causing sensor misalignment
Mitigation: Use materials with matched thermal expansion coefficients, incorporate thermal isolation features, implement temperature compensation in measurement software

Trigger: Mechanical vibration from nearby equipment
Failure: Resonant frequencies affecting measurement stability
Mitigation: Design with damping materials, optimize natural frequency through structural analysis, use vibration-isolating mounts

Trigger: Improper installation or maintenance
Failure: Gradual misalignment or seal degradation
Mitigation: Provide clear installation guides, design for easy inspection points, use locking fasteners, specify maintenance intervals

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Geometric tolerances per ISO 1101, dimensional tolerances per ISO 2768-mK

Test Method

Coordinate measuring machine (CMM) verification, laser tracker alignment checks, thermal cycling tests per IEC 60068-2-14, vibration testing per IEC 60068-2-6

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Array Housing/Frame

Manufacturer profiles associated with Array Housing/Frame.

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Frequently Asked Questions

What are the key design considerations for sensor array housings?

Key considerations include dimensional stability under thermal cycling, vibration damping properties, material compatibility with operating environment, precision of mounting features, cable routing provisions, and maintenance accessibility while maintaining protection ratings.

How does housing design affect measurement accuracy?

Housing design directly impacts accuracy through thermal expansion management, vibration isolation, precise sensor alignment maintenance, and protection from environmental contaminants that could affect laser optics or electronics.

Can array housings be customized for different sensor configurations?

Yes, they are typically custom-designed for specific sensor models and array patterns, with modular designs available for flexible configurations in multi-sensor measurement systems.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Array Housing/Frame